This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

The present invention relates to a temperature control system, a temperature control method and an image sensor-testing apparatus having the system. The temperature control method mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Provided is a component supply device that further reduces the burden on an operator as compared with the conventional art. The component supply device includes: a magazine unit provided with a magazine accommodating multiple pallets each of which holds multiple components; a pallet pulling-out mechanism configured to selectively pull out the pallet from the magazine and transfer the pallet to a component supply position of a component mounter; a storage configured to store a larger number of the multiple pallets than the magazine unit; and a replacement mechanism configured to replace the pallet between the magazine and the storage.

The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.

The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.

A component supply device including: a stage configured such that components can be scattered on the stage; a slide device configured to slide the stage; a contacting section configured to contact the component scattered on the stage in accordance with sliding of the stage by the slide device; and a control device configured to control operation of the slide device, wherein the control device includes a determining section configured to determine whether the stage has been slid to a set position when the stage is slid towards the contacting section, and an operation control section configured to control operation of the slide device so as to, in a case in which it is determined by the determining section that the stage has not been slid to the set position, after sliding the stage in a direction away from the contacting section, once again slide the stage towards the contacting section.

A tray-type component supply device includes a device main body, a magazine configured to be detachably held by the device main body and to accommodate multiple trays in each of which multiple components are arranged vertically, a shuttle mechanism configured to draw any of the trays from the magazine to enable the components to be supplied, a lifting/lowering mechanism configured to move the magazine or the shuttle mechanism up and down to select a tray to be drawn by the shuttle mechanism, and an automatic exchange section configured to exchange the magazine to be collected from the device main body and the magazine to be provided to the device main body.

A method for transporting and installing an electronic device having at least one first electrical contact element includes fixing the electronic device in a recess or interior of a reusable transport and assembly module such that access to the at least one first contact element is blocked by a protective element, transporting the transport and assembly module and the electronic device into a connection region of an electrical apparatus, removing the protective element so that the at least one first contact element is accessible, actuating an actuation apparatus provided on the transport and assembly module to move the electronic device in a direction out of the recess or interior into a contact position in which the at least one first contact element is brought into electrical contact with at least one second contact element provided on the electrical apparatus, and removing the transport and assembly module.

A crimping machine having a multiplicity of magazines for contact elements which are transportable to a transfer position via a conveyor device. A component to be crimped is then brought from the transfer position into a crimping position by means of a transport device. This transport device is assigned to all of the storage arrangements.