Patent classifications
H05K13/0434
Component supply device, component mounting system, and component mounting method
A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporting path transporting one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a component information storage being capable of storing component information of stick cases. A plurality of electronic components of same lot are accommodated in the plurality of stick cases, and the component information storage stores component information of a stick case read from one of the plurality of stick cases, as the component information of each of the plurality of stick cases.
Component supply device, component mounting system, and component mounting method
A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporter moving one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a stick case detector detecting presence or absence of one or more stick cases in the loader.
Component supply device, component mounting system, and component mounting method
A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state; a component transporting path transporting one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; a component detector being disposed on the component transporting path, the component detector detecting one or more electronic components on the component transporting path; a component number measurer measuring a first number of electronic components based on the detection result of the component detector; and a determiner determining a change of stick case which supplies one or more electronic components to the component supply position based on the first number of electronic components measured by the component number measurer and a second number of electronic components unloaded from the component supply position.
Electronic component mounting system and electronic component mounting method
In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
Board work system, and method for managing mounting order of components in board work system
A board work system which optimizes amounting order of components on a circuit board. In a case where an error rate which shows the number of defective dies included in the wafer provided in the wafer-type supply device is input by a user, an integrated control device uses the input value in processing. In addition, in a case where the error rate is not input by the user, the integrated control device decides a value obtained by averaging the number of defective dies of the same type of wafer in production information as the error rate. In addition, the system decides the mounting order of mounting the components of the tape-type supply device or the wafer-type supply device on the circuit board based on the decided error rate, or changes the mounting order after the decision.
LOAD MEASUREMENT METHOD AND COLLECTION METHOD
Before using a load cell to measure a load (nozzle load) arising during relative movement between a suction tube and a pipe of a suction nozzle, the suction nozzle and a metal contact tool are moved towards each other by a set load with the metal contact tool contacting the tip section of the suction tube. When the suction tube and the pipe has moved relatively by set amount due to the suction nozzle and metal contact tool being moved towards each other, the nozzle load of the suction nozzle is measured using the load cell. Nozzle load is measured only for a suction nozzle for which relative movement of the suction tube and the pipe has been confirmed, and nozzle load is measured appropriately without damaging the load sensor.
Electronic apparatus production system
An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.
Method, system and device for identifying a bin in an SMT system
A method in an automated Surface Mount Device (SMD) warehouse configured to store bins at predetermined positions within said automated Surface Mount Device (SMD) warehouse, the method comprising receiving a bin at a port of said automated Surface Mount Device (SMD) warehouse and scanning an identity tag attached to said bin to obtain a bin ID.
Load measurement method and collection method
Before using a load cell to measure a load (nozzle load) arising during relative movement between a suction tube and a pipe of a suction nozzle, the suction nozzle and a metal contact tool are moved towards each other by a set load with the metal contact tool contacting the tip section of the suction tube. When the suction tube and the pipe has moved relatively by set amount due to the suction nozzle and metal contact tool being moved towards each other, the nozzle load of the suction nozzle is measured using the load cell. Nozzle load is measured only for a suction nozzle for which relative movement of the suction tube and the pipe has been confirmed, and nozzle load is measured appropriately without damaging the load sensor.
ARTICLE SUPPLYING DEVICE
An article supplying device is provided. The article supplying device has a conveyance portion for conveying conveyed objects, and a movable block. The movable block includes a housing portion capable of housing one conveyed object at a receiving position in which the housing portion communicates with a downstream end of the conveyance portion. The movable block is capable of a reciprocal movement in a direction intersecting a receiving direction of the conveyed objects. Moreover, the movable block includes a biting preventing portion for pushing back a subsequent conveyed object entered into the housing portion after the conveyed object having been housed in the housing portion toward the conveyance portion.