An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.

A method for connecting an electronic component to a circuit board is disclosed. Initially, a substrate and an electronic component having solder located between them are placed under a flashlamp. Multiple light pulses from the flashlamp are applied to the electronic component, substrate and solder until the solder reflows. During the application of the light pulses, the power of one of the light pulses from the flashlamp and the temperature of the electronic component are measured, the measured power is converted to radiant exposure, and in response to the measured temperature of the electronic component, the duty cycle of a next light pulse is adjusted adaptively according to the radiant exposure of the one light pulse.

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

Heights of components or parts thereof are measured within a printing machine by measuring their relative rather than absolute heights. A virtual surface may be constructed from the measured heights, with a tolerance level employed based on the virtual surface. The invention is particularly suited to measurement of tooling components within a printing machine, such as tooling pins.

A printing parameter acquisition device includes an acquisition section and an output section. The acquisition section acquires a printing condition for specifying a member to be used when solder is printed on a board. The output section outputs, from a database that stores the printing condition, a printing parameter used for controlling driving of a printer, and a reliability of the printing parameter in association with each other, the printing parameter which is associated with the printing condition corresponding to the printing condition acquired by the acquisition section and of which the reliability is a predetermined level or more.

A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

A correction amount calculation device includes a selection section and a correction amount calculation section. The selection section is configured to select a target component in which a movement amount of the component on a board before and after being conveyed to a reflow furnace is equal to or less than a predetermined allowable value. The correction amount calculation section is configured to calculate a correction amount, which is used in a mounting process of a board product to be produced later, regarding a positional deviation amount of the mounting position of the target component selected by the selection section with respect to a target mounting position.

A method of inspecting a printed circuit board (PCB) assembly includes acquiring an image of the PCB assembly and analyzing the image, wherein the analysis includes an object-based analysis of the image for recognizing at least one component placed on the PCB, wherein the object-based analysis is performed based on an object-based analysis program, and wherein the object-based analysis program includes a trained machine learning model. The method further includes: determining whether the at least one component is placed on the PCB based on a comparison between a finding of the object-based analysis and stored assembly information for the PCB; outputting an error when one or more components are missing or wrongly placed; inputting a result of a visual inspection of the PCB assembly that indicates a pseudo-error of the object-detection analysis; and writing one or more settings for soldering the PCB assembly by a soldering device.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.