A component mounting machine includes an imaging device configured to image a supply position, to which a component is supplied from a component supply device, from above, a component detecting sensor configured to detect the component. A control device acquires component information related to the component supplied by the component supply device when a predetermined determination condition is established. Then the control device selects from multiple processing including first determination processing for determining presence or absence of a component shortage of the component supply device by determining presence or absence of the component at the supply position based on a captured image, and second determination processing for determining presence or absence of a component shortage of the component supply device by detecting the presence or absence of the component at the supply position by the component detecting sensor.

A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.

A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.

An image correction method for correcting multiple original images captured under illumination by multiple different light source colors in generating a composite image by superposing the original images, includes obtaining a correction amount for correcting a position of a fiducial mark recognized from a reference image of a specific light source color in reference images of the multiple different light source colors; obtaining correction amounts for correcting positions of the fiducial mark recognized from the reference images of other light source colors than a specific light source color to the reference position in the reference image of the specific light source color; and when the original images are captured, correcting collectively distortion aberration and chromatic aberration of the original images of the multiple different light source colors using the correction amounts associated with the multiple different light source colors.

An apparatus for manufacturing a display device including: a photographing member configured to photograph a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark, which are provided in a display panel; and a control member configured to set an imaginary reference point, taking into account the first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark, which are photographed by the photographing member. The control member sets a first position which is included in the imaginary reference point and at which a first imaginary straight line connecting the first alignment mark to the third alignment mark and a second imaginary straight line connecting the second alignment mark to the fourth alignment mark cross each other.

In light source device 60, which is disposed in a component mounter for holding a component by using mounting head 24 and mounting a held component that is the component that has been held on a board, and used when the held component is imaged by imaging device 50, and includes multiple light sources 62; and controller 64 configured to control the multiple light sources, when one or more of the multiple light sources do not emit light, the controller executes light intensity enhancement processing of enhancing an intensity of light emitted by any of the other light sources among the multiple light sources. By executing the light intensity enhancement processing, in a case where any of the multiple light sources fails, it is possible to reduce a possibility that a component mounting operation by the component mounter is stopped.

A component mounter includes a state recognition section configured to recognize a supply state of a component in a supply area based on a feature amount including at least one of a shape and an angle of each of multiple feature portions in image data on which image processing has been executed. The state recognition section determines whether one or more candidate feature portions included in a search range belong to an identical component together with a reference feature portion based on one of feature amounts of the candidate feature portion and a positional relationship between the reference feature portion and the candidate feature portion.

An image processing device for processing an image of a tape in which multiple cavities for accommodating a component are provided along a predetermined feeding direction includes a generation section configured to extract brightnesses of pixels of a line along the feeding direction from the image and to generate a brightness waveform of the line, and a recognition section configured to execute a periodic analysis of a brightness change from the brightness waveform and to recognize a pitch of the cavities based on a wavelength obtained by the periodic analysis.

A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.