In a component mounting system, recovery processing is repeated until a recovery count number Nr is larger than or equal to a defined count number Nth in a case where a pickup defect of a component occurs, an elapsed time is measured from error stoppage of a component mounting machine to canceling of the error stoppage in which the component mounting machine is error-stopped when the recovery count number Nr is larger than or equal to the defined count number Nth, the defined count number Nth is increased within a range in which the defined count number does not exceed the upper limit value Nmax in a case where the elapsed time is shorter than a defined time Tth, and the defined count number Nth returns to an initial value in a case where the elapsed time is longer than or equal to the defined time Tth.

Based on the measured values of the electrical characteristics of multiple components including a component positioned in the middle among many components held on the component tape, it is possible to more accurately estimate the electrical characteristics of the many components as compared with the case based on the measured value of the electrical characteristic of a component positioned at the leading end. Also, based on the statistically processed results of these measurement values, it is possible to appropriately evaluate the electrical characteristics of many components. Further, if the electrical characteristics of all of the components are measured, the evaluation can be performed more appropriately.

A computer automatic assembly system is proposed. The computer automatic assembly system includes: a database for storing information of an assembly and mounting area of a part combined to a mainboard, and program information such as information of a BIOS, a driving driver, and an operating system, and periodically updating the corresponding information through a communication part including a wired/wireless communication network; a device digestive module for checking the part through a photographing means, moving the checked part to the assembly and mounting area of the part provided on the mainboard through the photographing means and a robot arm for transfer, assembling, and mounting the part, and then writing a driving program and circuit information of the part; and an administrator terminal for periodically upgrading or updating part information necessary for the device digestive module by a part company server through a communication network including the wired/wireless communication network.

In a work machine which includes a working head including a lifting and lowering unit including a working device and a first lifting and lowering device which lifts and lowers the working device, and a second lifting and lowering device which lifts and lowers the lifting and lowering unit, a positional deviation (Δx, Δy) of the working device in a direction which is perpendicular to a lifting and lowering direction is eliminated. Since the positional deviation is caused by both an inclination of a lifting and lowering axis line L.sub.1 of the working device by the first lifting and lowering device and an inclination of a lifting and lowering axis line L.sub.2 of the lifting and lowering unit by the second lifting and lowering device, based on positional deviation data a target moving position is corrected.

A method for mounting an electronic component onto a circuit board. The method may include preparing a mounting device including a rotatable mounting head, a holding means to hold the electronic component, a component recognition camera, a memory device, and a microcomputer, the electronic component being mounted onto the circuit board based on a result of performing recognition processing with respect to an acquired image, determining a mid-operation instruction action mode at start of a production operation, executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode, and executing the instruction at a longer time interval when the instruction has continuously met a required accuracy more than once.

A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A method, a system and an archive server for determining an illumination setting for capturing an image of a component, belonging to a specific package type, in a pick- and-place machine are provided. The method comprises capturing a first image of a first component of the specific package type while the first component is illuminated by a first illumination component, and capturing a second image of the first component while the first component is illuminated by a second illumination component, the second illumination component being different from the first illumination component. An illumination setting may then be determined by creating a plurality of generated images based on the first and second image of the first component, and selecting the generated image that fulfils a predetermined quality measure.

A pick-and-place machine module is provided. The pick-and-place machine module includes a nozzle and a collet disk. The nozzle includes a body, a head and a tubular element extending between the body and the head such that the head is communicative with the body via the tubular element to enable a pick-up of a component by the head. The collet disk is affixed to a surface of the body facing the head about the tubular element and is configured to reflect light incident thereon toward an area of the base surrounding the component.

A component mounting machine includes a head having a holding member configured to hold the component, and a control device. The control device performs a pre-mounting inspection for inspecting a state of a component held in the holding member, and controls the head so that the component held in the holding member is mounted on the board in a case where a determination of normality is made in the pre-mounting inspection. In addition, the control device performs a post-mounting inspection for inspecting a state of the component already mounted on the board by the head in a case where a determination of abnormality is made in the pre-mounting inspection or in a case where a determination of abnormality suspicion is made which is within an allowable range determined to be normal but is suspected to be abnormal in the pre-mounting inspection.