Patent classifications
H05K13/0813
Component-mounting device
A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.
COMPONENT MOUNTER
A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.
COMPONENT MOUNTING MACHINE AND SUBSTRATE WORK SYSTEM
A component mounting machine includes a component supply device, a head having a nozzle, and a control device configured to control each device. The control device is configured to control a cameras to image a component, determine the normality and abnormality of an operation executed immediately before a current imaging timing based on an image captured at the current imaging timing, classify the image captured at the current imaging timing as a normal image in a case in which a result of determination of the normality and abnormality is made as normal, and classify the image captured at the current imaging timing and a part or all of images captured at imaging timings prior to the current imaging timing as an abnormal image in a case in which the result of the determination of the normality and abnormality is made as abnormal.
IMAGE DISPLAY DEVICE AND IMAGE DISPLAY METHOD
An image display device configured to display, on a display screen, a predetermined image captured in a state in which multiple components to be mounted on a board are held by a mounting head, including: a display control section configured to selectably display, on the display screen, relevant information relating to the multiple components in association with each component, together with the predetermined image, and when a predetermined operation involving selection of any of the relevant information is performed by an operator, display an enlarged image of one component corresponding to the selected relevant information of the predetermined image being displayed.
Board work machine and insertion method
In a component mounter provided with a holding tool configured to hold leaded component, a moving device configured to move the holding tool, and an imaging device configured to image a leaded component held by the holding tool, the lengths of the pair of leads of leaded component are different. With respect to this, operation of the moving devices is controlled based on imaging data of the leaded component captured by the imaging device, and the tip section of long lead of the pair of leads of the leaded component held by the holding tool is inserted in a through-hole. Next, leaded component is moved such that short lead is positioned above a through-hole, and the short lead is inserted into the through-hole. That is, the pair of leads are inserted into the through-holes in order of proximity of the tips to circuit board, closer leads being inserted earlier.
Surface mounter, component recognition device and component recognition method
A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.
Component mounting device
A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, and an imaging unit provided on the head unit and configured to image at least one of a suction position of the component to be suctioned by the mounting head and a mounting position of the component mounted by the mounting head from a plurality of directions, such that the imaging unit is configured to capture a first image and a second image. The component mounting device is configured to expand or contract the first image captured by the imaging unit in accordance with an imaging direction of the second image, and acquire a height position of an imaged location based on the first image that has been expanded or contracted and the second image.
COMPONENT MOUNTING DEVICE
A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.
COMPONENT MOUNTING MACHINE
A component mounting machine includes a mark imaging camera that images a board mark of a circuit board and has a function of identifying an identification target, such as a character attached to an upper surface of a component supplied by a component supply device. An illumination light source illuminates the identification target on the upper surface of the component imaged by the mark imaging camera and is attached to a lower portion of an electric component holding frame provided to protrude to the side of the mounting head. As the identification target on the upper surface of the component, which is illuminated by the illumination light source from obliquely above, is imaged by the mark imaging camera from above and the image is processed, the identification target on the upper surface of the component is identified.
Light emitting component mounting method
A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.