A component mounting device capable of selectively performing a tolerance check mode that recognizes a position of a lead after determining whether the size of a lead region is within a tolerance range, and a non-tolerance check mode that recognizes a position of the lead without performing determination of whether the size of the lead region is within the tolerance range. Therefore, even in cases in which it is difficult to set a tolerance range due to the tip of the lead being covered with a viscous fluid such as solder or plating, the position of the lead is appropriately recognized.

A loose component supply device includes a loose component support section that supports multiple components in a loose state, an imaging device that images the components supported on the loose component support section, a component holding head provided with at least one component holding tool capable of picking up and holding each of the components supported on the loose component support section, a holding head moving device that moves the component holding head at least to and from the loose component support section and a component transfer section at which transfer to a next process is possible, and a holding tool changing device that changes at least one of the one component holding tools based on image data obtained by the imaging of the imaging device.

Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, and storage device 115. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90. Electronic component mounting device 10 holds a supplied electronic component with mounting head 26, and images the held electronic component with component camera 90. Controller 102 performs image processing on captured image data with image processing device 110 to determine the acceptability and position of the electronic component (S6). Controller 102 monitors the start and end of the storage period (S10, S13) based on the magnitude relationship between the error rate calculated from the determination result information in the error rate calculation process (S8) and the reference error rate (S9). If the image data captured with component camera 90 is stored within the storage period, controller 102 stores the image data in storage device 115 (S11).

A control device is configured as an information processing apparatus which is used for a mounting apparatus for mounting a component on a board. The control device acquires an image, including at least a reference portion in a state where a component is gripped by a component gripper having a positioning grip portion that grips the component in a positioned state, and having the reference portion that represents a reference position serving as a predetermined relative position to the position of the component gripped by the positioning grip portion, acquires a position of the reference portion based on the acquired image, and acquires a position of the component based on the relative position to the acquired position of the reference portion.

A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Provided is an image processing method for easily viewing images obtained by imaging multiple components at a time, the method including image capturing processing of capturing each component holding state relating to multiple suction nozzles mounted on a mounting head as one image, image dividing processing of dividing a region relating to a predetermined component holding state for image data of the multiple component holding states obtained by the image capturing processing, direction conversion processing of converting a direction of the component holding state for divided image data divided by the image dividing processing, and display processing of displaying an image based on the divided image data subjected to the direction conversion processing.

A recognition device includes an imaging device that images a tip of the lead of a lead component multiple times at different shutter speeds, and multiple pieces of captured image data corresponding to the multiple times of imaging are generated. Then, it is determined whether the tip position of the lead is recognizable based on each of the multiple pieces of captured image data, and a shutter speed between the fastest shutter speed and the slowest shutter speed among the shutter speeds at the time of imaging according to the pieces of captured image data, which are determined to be recognizable, is determined as the optimum shutter speed. By determining the optimum shutter speed in this manner, the exposure light amount at the time of imaging can be stabilized regardless of the shape of the tip of the lead, and the tip position of the lead can be appropriately recognized.

A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.

A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.