A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.

An electronic component mounting method including a preparatory imaging step of storing preparation position information of component holding sections obtained based on preparation images imaged with no electronic component held by the component holding sections and with a rotary head indexed to multiple indexing angles; a pick-up step of picking up electronic components; an angle information acquisition step of acquiring indexing angle information of the rotary head; a component imaging step of imaging the electronic components with the indexing angle of the rotary head made to coincide with an indexing angle of the rotary head that corresponds to the specific positional information; and a measurement step of measuring a positional deviation amount between a position of the multiple component holding sections that is recognized from the specific positional information and a position of the electronic component that is recognized from the component image obtained in the component imaging step.

If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated. Thus, appropriate mounting can be guaranteed by performing correction of the component holding position, correction of the component loading position, or the like, based on the deviation amount.

A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.

A component mounter comprises a mounting head that holds a plurality of nozzles. Two imaging positions are provided for the circumferential orbit along which the nozzles of the mounting head are arranged. While the nozzles are rotated continuously about the rotation axis, an operation of imaging the nozzles located at the imaging positions is performed for each of the imaging positions. Therefore, in a period when the nozzles rotate by an angle not larger than a predetermined angle around the rotation axis formed by the interval between the two imaging positions adjacent to each other along the circumferential orbit, imaging of the nozzles can be completed by locating each of the nozzles at one of the two imaging positions. As a result, it becomes possible to image the plurality of nozzles of the mounting head efficiently.

A component image obtained by imaging a component for which component shape data for image processing is to be created is acquired and displayed on a screen of a display device, and a model pattern corresponding to a measurement target portion of the component image is displayed on the component image in a superimposed manner. At least one fine adjustment icon of fine adjustment icons for finely adjusting a size and/or position of the model pattern superimposed on the component image on the screen of the display device is displayed on the screen of the display device in a predetermined positional relationship with the model pattern.

The mounting device comprises: a mounting head, having a pickup member picking up a component, which moves and places the component at a placement position by picking up the component with the pickup member from a supply section having a holding member holding the component; an imaging section configured to image the component held by the mounting head; and a control section configured to execute: a first placement process in which the component is picked up by the mounting head, positional deviation is corrected based on imaging results of the component captured by the imaging section, and the component is placed at the placement position, and a second placement process in which the component is placed at the placement position by omitting the imaging process by the imaging section at the mounting head when the positional deviation is within a predetermined allowable range.

A system for detecting electronic components includes a light-source device, a photography device, an adjustment device, and an image-processing device. The light-source device generates a light to illuminate at least one pin of a first electronic component at different rotation angles. The photography device senses the light and generates first and second images corresponding to the pin of the first electronic component at different rotation angles. The adjustment device adjusts the photography device and the light-source device to a first height and a second height, wherein the first images correspond to the first height and the second images correspond to the second height. The image-processing device calculates first feature information of the pin of the first electronic component according the first and second images, and analyzes the state of the pin of the first electronic component according to the first feature information.

A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.