A multiple lens-based smart mechanical arm, wherein it comprises a multi joint multi-functional mechanical arm, a CCD camera for collecting PCB board images to be assembled, a bio-contact device, and a computer; the CCD camera is mounted on the multi joint multi-functional mechanical arm, the bio-contact device is mounted on the fingertip of the multi joint multi-functional mechanical arm, and the CCD camera, and the bio-contact device and the multi joint multi-functional mechanical arm are connected to the computer. The invention adds a biological tactile device on the basis of the binocular positioning to accurately locate the assembly target area and improve the accuracy of the assembly of the irregular parts. The conversion relationship between the pressure and electric output of the sensitive material in the bio-contact device and the mathematical model of pressure and position is applied. The present invention realizes high-precision and real-time assembly of irregular parts and improves the production efficiency of the electronic assembly industry.

A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.

A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.

A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

A mounting board manufacturing system includes: a component placer including a placing head and a placing head mover that moves the placing head to a target position for placing the component on the board; an inspector that inspects a placement position of the component by imaging the board; a correction value calculator that calculates a correction value for correcting the target position; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed.

A substrate working device including: an imaging device configured to image a substrate; a memory device configured to memorize various information; and an image processing device configured to perform, when specified work is performed with respect to multiple substrates, for a leading substrate, leading-substrate processing of performing imaging processing for detecting a specified detection target required for the specified work with respect to a leading image obtained by imaging the leading substrate using the imaging device, acquiring region information related to a region in the leading image in which the detection target was detected, and memorizing the region information in the memory device, and, for subsequent substrates except for the leading substrate, subsequent-substrate processing of setting a partial processing region in a subsequent image of the subsequent substrate captured by the imaging device based on the region information, and performing the image processing with respect to the set processing region.

After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its focal plane configured at a first distance from the second optical system. After the bond head is moved adjacent to the second optical system, the second optical system views and determines a position and orientation of the bond head when the second optical system has its focal plane configured at a second distance from the second optical system. The position and orientation of the die may then be adjusted to correct a relative offset between the die and the bonding location prior to depositing the die onto the bonding location.

The substrate processing management system for a substrate processing line including a defect tallying section to calculate a defect rate representing a rate of occurrence of substrates or electronic components determined to be defective with the substrate inspection machine, or obtain a number of defective products having substrates or electronic components determined to be defective; an attribute change recognition section to recognize when an attribute, among the attributes of the electronic component, having a possibility of affecting the inspection, has changed in the component mounting machine; a fault point estimation section to estimate, when the defect rate or the number of defective products exceeds a predetermined value, which of the component mounting machine or the substrate inspection machine is a fault point depending on whether an attribute has changed; and a countermeasure calling section configured to call for a defect countermeasure to the estimated fault point.

A component mounting machine, including a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and a control device configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head.