A method of inspecting a printed circuit board (PCB) assembly includes acquiring an image of the PCB assembly and analyzing the image, wherein the analysis includes an object-based analysis of the image for recognizing at least one component placed on the PCB, wherein the object-based analysis is performed based on an object-based analysis program, and wherein the object-based analysis program includes a trained machine learning model. The method further includes: determining whether the at least one component is placed on the PCB based on a comparison between a finding of the object-based analysis and stored assembly information for the PCB; outputting an error when one or more components are missing or wrongly placed; inputting a result of a visual inspection of the PCB assembly that indicates a pseudo-error of the object-detection analysis; and writing one or more settings for soldering the PCB assembly by a soldering device.

A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.

A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.

A device for estimating a cause of a mounting error includes a first determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the first factor is specified according to a difference in the second factor, on each of multiple individuals as the first factor, a second determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the second factor is specified according to a difference in the first factor, on each of multiple individuals as the second factor, and a cause estimation section configured to estimate a causative individual causing the mounting error based on determination results in the first determination section and the second determination section.

An analysis device is a device for use for a component mounting device including a pickup member configured to be moved relative to a board by means of a moving device and a contact detection sensor configured to detect that a component picked up by the pickup member is brought into contact with the board to analyze a mounting state of the component mounting device. The analysis device includes a storage device configured to store multiple detection result data relating to detection results obtained by the contact detection sensor when the component is mounted on the board in association with mounting conditions when the detection results are obtained by the contact detection sensor, and an output device configured to count the multiple detection result data stored in the storage device by at least two conditions in the mounting conditions and output the multiple detection result data so counted.

The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.

The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height.

A component type management device includes an association registration section configured to register association data in which individual identification information of a component supply device which is attached to a component mounter and supplies a component is associated with a type of the component held in the component supply device, an association discarding section configured to discard the association data in a case where a predetermined condition is satisfied after the component supply device is detached from the component mounter, a detachment discrimination section configured to discriminate whether the component supply device is detached by an automatic exchanging device; and an association maintaining section configured to invalidate a function of the association discarding section before the predetermined condition is satisfied and maintain the association data in a case of being discriminated that the component supply device is detached by the automatic exchanging device.

An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.