A method for repairing a semiconductor chip and a device for repairing a semiconductor chip is provided, and the method for repairing a semiconductor chip includes: providing a plurality of light-emitting units, and at least one of the light-emitting units being a damaged light-emitting unit; next, removing the damaged light-emitting unit to form an unoccupied position; then, using a pick and place module to obtain a good light-emitting unit from a carrier board; then, a volatile adhesive material is formed on the bottom of the good light-emitting unit; next, the volatile adhesive material is used to adhere the good light-emitting unit to the unoccupied position; finally, the good light-emitting unit is heated so that the good light-emitting unit is fixed onto the unoccupied position.

A mounting device includes a control device. The control device images an imaging range which includes an illuminant of a light emitting component and acquires a light emitting component image when mounting the light emitting component which includes the illuminant onto a board. Next, the control device detects coordinates (illuminant detected center coordinates) of a center of the illuminant based on the light emitting component image. The control device performs the mounting of the light emitting component such that the light emitting component is held, the light emitting component moves over the board, and a center of the illuminant is positioned at predetermined coordinates on the board based on the illuminant detected center coordinates, without using information relating to an outer shape of the light emitting component which is based on the light emitting component image.

A component mounting device for mounting a component on a substrate includes a head unit, a driver to move the head unit on a stage, and a controller. The head unit includes a mounting head to hold the component and a stereo camera to capture a three-dimensional image of an object. The controller performs image capturing, calculating and mounting processes. The image capturing captures an image of a relevant area including a mounting point on the substrate by the stereo cameras before the component reaches the mounting point. The calculating calculates a correction amount with respect to X, Y and Z axes directions based on three-dimensional information on the relevant area with respect to the directions obtained in the image capturing process to mount the component on lands corresponding to the mounting point. The mounting includes correcting the mounting point based on the correction amount and mounting the component.

A component mounting machine including a mounting head configured to pick up and mount a component; a component camera to image the component from below the mounting head; a board camera to image the circuit board from above; an imaging position memory to memorize imaging position coordinates during imaging, based on images acquired by the component camera; a relative position memory to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory, based on a position of the mounting head understood from the images acquired from the imaging.

An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

A device for aligning and optically inspecting a semiconductor component arranged on a receiving tool that is arranged on a turning mechanism. The device aligns the semiconductor component in relation to a center of the receiving tool in at least one axis direction and/or a direction of rotation. The turning mechanism is designed to rotate about a turning axis and to move the semiconductor component out of a receiving position into an offset position, with two slides that can be moved towards and away from each other and comprise slide sections, the two slide sections coming to rest on two lateral surfaces of the semiconductor component, at least in sections, in order to align the semiconductor component arranged on the receiving tool, the slide being defined such that it slides and/or rotates the semiconductor component into an inspection position, while the receiving tool holds the semiconductor component.

A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.

An assembly system that includes a robot adapted to grip an electronic device to be mounted on a circuit board, a first vision system that identifies a position and a posture of the electronic device gripped by the robot, a fixing device that fixe a plurality of circuit boards thereon, and a second vision system that identifies a position and a posture of the circuit board fixed on the fixing device. The robot mounts the gripped electronic device on a circuit board under the visual guidance of the first vision system and the second vision system. The view field of the second vision system is not capable of completely covering a surface region of all circuit boards fixed on the fixing device. The assembly system further includes a moving mechanism that moves the second vision system in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, so that the second vision system completes identification of all circuit boards on the fixing device step by step. With this assembly system, the robot complete the assembly work of all circuit boards at an assembly station. Also, a method of assembling a circuit board that mounts a gripped electronic device on a circuit board.

A coordinate data generation device is used in a component mounter configured to perform processing for mounting electronic components on boards of different dimensions by imaging the board that is controlled to be conveyed and stopped at a target position and performing the mounting of the electronic components after correcting for a deviation between a stopping position of the board identified from an image captured by the imaging and a target position, and specifies an imaging region for imaging the board stopped at the stopping position.