A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

The three-dimensional mounting device includes a supporting section capable of fixing a processing target, an application section for applying a viscous fluid to the processing target, a mounting section for arranging a component on the processing target, an imaging section for imaging the processing target, and a control section for controlling the processing section including the supporting section, the application section, the mounting section, and the imaging section. One or more of the supporting section, the application section, the mounting section, and the imaging section has multiple tilt axes and is capable of tilting the processing target and/or the processing section in multiple directions. The control section performs coordinate correction using the circuit pattern on the forming surface as a reference position, and arranges the component on the mounting section.

An apparatus, a recording medium, and a method for generating a control parameter of a screen printer are disclosed. The apparatus includes a memory that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor electrically connected to the memory and the communication circuit. The processor obtains first predictive inspection information by applying the first control parameter to the simulation model, generates a plurality of candidate control parameters based on the first predictive inspection information, determines a plurality of second control parameters among the candidate control parameters, and transmits the plurality of second control parameters to the screen printer via the communication circuit.

An embodiment of the present invention provides a method of manufacture thereof controlled alloy amount, height, quality, and optical alignment joining the microelectronic test interface substrate to the printed circuit test load board and real time alloy quality inspection of the test load board system. An embodiment of the system platform comprising: a microelectronic test interface substrate and a printed circuit test load board, such as probe card system and device test load board system.

An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.

A transfer state inspection system including a camera configured to capture a transfer state of a transfer material of any of solder, flux, conductive paste, or adhesive transferred to multiple terminals on a lower surface of an electronic component; an image processing section configured to process an image captured by the camera to recognize the transfer state of the transfer material such that the transfer state inspection system inspects the transfer state of the transfer material based on a recognition result of the image processing section; an inspection target specifying section configured to specify whether inspection is necessary for at least a portion of the terminals among the multiple terminals on the lower surface of the electronic component via an operation from an operator or a production program; and an inspection executing section configured to not inspect the transfer state of the transfer material for terminals specified as unnecessary.

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.