A virtual terminal definition which defines that a terminal does not exist with respect to component data on one side, at a position of the terminal which does not exist in the component data on one side, and exists in the component data on the other side, among plural pieces of component data in which a positional coordinate between the existing terminals, and the terminal size are substantially the same as each other, and the number of terminals is different, is added.

A chip pin connection status display method applied to a computer device is provided. The method includes generating a two-dimensional matrix with n rows and m columns according to a total number n of solder balls and a total number m of pins of a chip. Once an input signal and an input position of the input signal from the two-dimensional matrix are detected, display is performed at the input position on the two-dimensional matrix according to a type of the input signal and the input position of the input signal.

In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting informationwhen component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.

A manufacturing system for applying a material to a workpiece comprising a blade unit having a blade element for selectively moving along first and second axes for applying the material to the workpiece. A reciprocating motor is coupled to the blade unit for reciprocating the blade element along the first axis concurrent with movement of the blade element along the second axis, and a vibration detector is coupled to the blade unit for detecting the vibrational movement of the blade element. The vibration detector generates an output signal corresponding to the vibrational movement of the blade element. A control unit is coupled to the vibration detector for generating an output signal in response to the vibration detector signal, and a regulating device adjusts a parameter of the reciprocating motor in response to the output signal of the control unit.

The present disclosure provides an inspection device for use in a mounting system including a mounting device for disposing a component on a board, including a control section configured to extract a mass area included in a captured image resulting from imaging a processing target object where a viscous fluid is formed at a predetermined part, obtain a center of gravity of the mass area so extracted, and determine whether the center of gravity is included in a normal range of the predetermined part as a reference of the captured image to thereby determine whether a bridge has occurred where the viscous fluid is formed over adjacent predetermined parts.

A solder printing inspection device includes: an illumination device that irradiates, with a predetermined light, a printed circuit board on which a solder paste is printed; an imaging device that takes an image of the printed circuit board irradiated with the predetermined light and obtains image data; and a control device that: based on the image data, obtain three-dimensional measurement data of the solder paste printed on the printed circuit board, based on the three-dimensional measurement data, extracts upper portion shape data of an upper portion of the solder paste, the upper portion having a height equal to or higher than a predetermined height, and compares the upper portion shape data with a predetermined criterion and determines whether a quality of a three-dimensional shape of the upper portion of the solder paste is good or poor.

A system for determining a degree of contamination of production units of a production line for the printing, equipping and reflow soldering of printed circuit boards, and evaluation unit.

A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P.sub.x,y,z), and/or a device acceleration (a.sub.x,y,z). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (P.sub.x,y,z), and/or a first device acceleration (a.sub.x,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (P.sub.x,y,z), and/or a second device acceleration (a.sub.x,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (P.sub.x,y,z), and/or the device acceleration (a.sub.x,y,z).