The component mounting machine includes a head, a head moving device, an imaging device, and a control device. The control device executes a lower component mounting operation that mounts a lower component on a board, an upper component mounting operation that mounts an upper component on the lower component mounted on the board, and a lower component mounting inspection operation that images the board on which the lower component is mounted, and performs a mounting inspection of the lower component based on a captured image after the lower component mounting operation is performed and before the upper component mounting operation is performed.

This component mounting apparatus includes a head portion capable of mounting a component suctioned by a nozzle on a board, a board imaging portion provided on the head portion to be movable relative to the head portion so as to image the board, and an imaging position correction mark provided in the head portion to be capable of being imaged by the board imaging portion and is configured to correct the displacement of the board imaging portion relative to the head portion on the basis of an image of the imaging position correction mark imaged by the board imaging portion.

A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

A component orientation determination data creation device for creating component orientation determination data used in a component orientation determination system that determines an orientation of the component by comparing a brightness value of a determination region specified in the component orientation determination data within an image of the component captured by a camera with a determination threshold. A difference image between an image of the component in a correct orientation and an image of the component in another orientation is calculated by acquiring multiple images of the component in different orientations by changing the orientation with respect to the camera of the component that is the target for the component orientation determination data creation.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

Aboard inspection device includes: an imaging device that takes an image of an area on the board where the adhesive is applied; a CPU that specifies, by a first procedure, a center portion area of the adhesive in the image; specifies, by a second procedure, a foot portion area of the adhesive around the center portion area in the image; specifies an entire area of the adhesive based on the center portion area and the foot portion area; and based on the entire area of the adhesive, determines whether a quality of the adhesive is good or poor. The adhesive has a red color and is applied on a green resist area, and when specifying the foot portion area, the CPU extracts, an area of lower saturation than a predetermined saturation reference value from a saturation image based on the image.

A test device is disclosed for verifying the accuracy of a pick and place process. The test device includes a surface configured to receive components, and a ferromagnetic layer located under the surface. A system is further disclosed including the test device and a plurality of components each including a magnetic element, the plurality of components configured to be received by a plurality of pockets of the test device. A method of picking and placing a component onto the test device is further disclosed.

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.

The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.