A component mounting device with which an improvement in production efficiency may be achieved by adjusting the timing of the Q-axis rotation is provided.

A component mounting machine including: a nozzle that picks up a component; sliders and a ball screw that move the nozzle in horizontal and vertical directions; a reel unit that supplies components; a board conveyance device that holds and conveys a board on which components are mounted; a parts camera that irradiates a component held by the nozzle with light to image the component from below; and a controller that performs various control functions, is provided. The controller obtains a clearance height at which an obstacle between the parts camera and a predetermined mounting position on a board can be avoided, extracts from an HDD an imageable range of the component, and sets a target height of a lower surface of the component held by the nozzle when the nozzle passes above the parts camera, such that the target height is closest to the clearance height within the imageable range.

There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.

An operation checking device of an electronic component mounting machine is provided with a first memory section configured to memorize an operation program of the electronic component mounting machine including at least a collection operation of an electronic component by a collecting device; a second memory section configured to memorize shape data of the electronic component and shape data of the collecting device; a first acquiring section configured to acquire information of the electronic components and information of the collecting device based on the operation program required for a current operation memorized on the first memory section; and a second acquiring section configured to acquire corresponding shape data of the electronic component and shape data of the collecting device from the second memory section based on the information of the electronic component and the information of the collecting device acquired by the first acquiring section.

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.

A substrate stopping position determination method of an electronic component mounting machine, is provided with a movement time calculation step of calculating movement times in which two mounting heads move in order to mount electronic components when a first substrate is positioned in a first side and a second substrate is positioned in a second side, an interference loss time calculation step of calculating an interference loss time in which, while one of the two mounting heads enters an interference area, the other waits to enter the interference area, and a stopping position determination step of determining the first and the second side set position which are selected from among all combinations as substrate stopping positions based on total movement times which are calculated for all of the combinations of the first and the second side set position and the interference loss time.

A component mounting system starts mounting processing in a state in which a portion of the initial set target feeders of the multiple feeders required for mounting processing are set in supply area of component mounter, and in which remaining feeders are not set in supply area of component mounter. Mounting processing is performed while switching feeders that have finished supplying components with remaining feeders using exchange robot during mounting processing of a single board. By this, because it is possible to perform mounting processing while exchanging required feeders within the range of the upper limit loading quantity of component mounter, it is possible to improve the efficiency of mounting processing.

A mounting head is formed of a main body section and a plurality of nozzle holding units, and each of the plurality of nozzle holding units is mounted to the main body section in an exchangeable manner. The height of a suction nozzle when the mounting head is moving over a circuit board is different for each of the plurality of nozzle holding units. In a mounting machine using such a mounting head, due to an installation position optimization program being executed, an installation position of a tape feeder in which electronic components which are scheduled to be mounted to the circuit board which is conveyed by one of a pair of conveyance devices are stored is set to a tape feeder installation table of a supply device of a side close to the one conveyance device of the pair of supply devices.

A CPU of a management computer sets an nth component in a mounting operation order of the current sequence as a target component, calculates nearby state data of the target component, sets the required accuracy of the target component based on the nearby state data and memorizes the required accuracy of HDD. Because the required accuracy is automatically set based on the nearby state data in this manner, the set required accuracy matches actual circumstances better compared to than with conventional technology. Therefore, it is possible to automatically set appropriate required accuracy of a target component.

A component mounting station is divided into two component mounting areas in a board conveyance direction according to the size of circuit boards used in two types of production that are performed in order, and the area in which a backup pin is arranged on a backup plate is divided into two pin arrangement areas corresponding to the two component mounting areas. The quantity of backup pins necessary to support the component mounting board are arranged in a predetermined arrangement pattern, the circuit boards transported using the conveyor are stopped in the component mounting areas according to the type of component mounting board produced, the backup plate is lifted up, and the circuit boards are clamped by the clamp member, and the circuit boards supported by the backup pins in the pin arrangement areas are positioned below the circuit boards, and components are mounted on the circuit boards.