A component mounting device with which an improvement in production efficiency may be achieved by adjusting the timing of the Q-axis rotation is provided.

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.

A component mounting machine moves a mounting head from a supply position P1 to each of mounting positions P3 and P4 of a circuit board CB via an imaging position P2. Further, the component mounting machine performs control such that the mounting head moves in a direction of movement at the time of imaging that is either of an X-axis direction or a Y-axis direction when passing through the imaging position P2. The component mounting machine determines the direction of movement at the time of imaging, according to a first X-axis distance Lx and a first Y-axis distance Ly from the imaging position P2 to each of the mounting positions P3 and P4.

The component mounter is a component mounter including a mounting control section configured to execute a mounting process based on a control program in which an execution order of a PP cycle including a collection operation of components and a mounting operation of mounting the components on a board is set, a supply control section configured to cause a bulk feeder supplying multiple components in a bulk state to execute a supply operation of the components at a predetermined execution timing, and a timing setting section configured to set the execution timing of the supply operation based on a current collectable quantity and a required time for the supply operation so that, in the PP cycle to be executed, a difference between a required quantity of the components to be collected from the bulk feeder and the collectable quantity of the components in the bulk feeder is not less than a reference value, and waiting time for waiting for completion of the supply operation before execution of the collection operation is minimized.