The present invention provides a system for detecting access to a pre-defined area on a Printed Circuit Board, wherein the system comprises: the Printed Circuit Board comprising, on at least one of its external surfaces, at least one pre-defined area comprising electrical components, a potting material arranged over at least the pre-defined area, wherein the potting material comprises a first layer of transparent material configured to allow light to pass through, and a second layer of opaque material arranged so that completely blocks light towards the first layer, wherein the first layer is arranged between the Printed Circuit Board and the second layer and extends at least over the pre-defined area, and at least one photo-sensor arranged within the first layer of transparent material and configured to generate a tamper signal upon detection of light in the first layer.

A light emitting device includes a printed circuit board (PCB) substrate, a first ink layer covering the PCB substrate, the first ink layer having a first refractive index, light emitters on the first ink layer, and a second ink layer on the first ink layer and spaced apart from the light emitters, the second ink layer having a second refractive index different from the first refractive index.

The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).

A transparent conductive film includes a transparent insulating substrate, a first electrode, and a second electrode, in which a first thin metal wire 38 of the first electrode has a first front surface 38A being directed to the viewing side and having a line width W1A, and a first back surface 38B being directed to the side opposite to the viewing side and having a line width W1B, a second thin metal wire 39 of the second electrode has a second front surface 39A being directed to the viewing side and having a line width W2A, and a second back surface 39B being directed to the side opposite to the viewing side and having a line width W2B, the W1A, W1B, W2A, and W2B are 0.5 to 10 μm, W1A is larger than W1B and W2A is larger than W2B.

According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.

The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.

Provided are a transparent electrode and a production method thereof, the transparent electrode using metal nanowires and/or metal nanotubes as conductive components, and showing favorable surface flatness, conductivity, and light transmittance. A transparent conductive ink is prepared by dispersing metal nanowires and/or metal nanotubes in a solution formed by dissolving a thermoset or thermoplastic binder resin having no fluidity within the range of 5 to 40° C. to a solvent, the content of the binder resin being 100 to 2500 parts by mass relative to 100 parts by mass of the metal nanowires and/or metal nanotubes. An electrode pattern having a desired shape is printed on a substrate with the transparent conductive ink, and pulsed light is irradiated to the printed electrode pattern, to thereby obtain a transparent electrode having a surface resistance of 0.1 to 500Ω/□ and a surface arithmetic average roughness Ra satisfying Ra≦5 nm.

An illumination apparatus for a vehicle storage cavity is disclosed. The apparatus comprises a circuit disposed proximate to and extending significantly along an opening of the cavity. At least one proximity sensor and a plurality of LEDs suspended in a semiconductor ink are printed on the circuit. The circuit is configured to activate an emission from the LEDs in response to the proximity sensor detecting an object entering the storage cavity.

Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion.

Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.