A display device includes a first substrate on which a thin film transistor is formed and which is divided into a display area and a non-display area outside thereof, a second substrate arranged to face an upper surface of the first substrate, a light-shielding film provided in an area between the first substrate and the second substrate, and a circuit provided on an upper surface of the second substrate and in an area facing the display area. The second substrate includes a terminal part of the circuit, which is provided on the upper surface of the second substrate and in an area facing the non-display area. The terminal part is connected with a circuit driving substrate, which drives the circuit through an anisotropic conductive film covering the terminal part. The light-shielding film is provided to avoid at least part of an area facing the terminal part.

One ultraviolet-curable resin composition of the present invention includes: (A) at least one polymer selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); (B) a compound having at least two secondary thiol groups in a molecule thereof; (C) a photopolymerization initiator a solution of which in acetonitrile with a concentration of 500 ppm has an absorbance of 0.50 or more in an optical path length of 10 mm at 385 nm; and (D) an organic compound that emits light upon absorbing ultraviolet rays, having a maximum wavelength of an absorption spectrum in a range of 300 nm or more and 450 nm or less, and having a maximum wavelength of an emission spectrum in a range of 350 nm or more and 500 nm or less; wherein a content of the compound (B) is 10 mass % or more and 70 mass % or less based on 100 mass % of the resin composition in terms of solid content.

A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways include a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosensitive layer and configure the conductive pathway in the photosensitive layer according to the image.

Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

A planar illumination device includes: a light guide plate; a point light source disposed to face a light incident surface of the light guide plate; and a circuit substrate on which the point light source is mounted. The circuit substrate includes: a base film; a first conductive layer and a first coverlay film stacked in sequence on a first surface of the base film, the first conductive layer including a pair of lands to which a pair of electrode terminals of the point light source are electrically connected; and a second conductive layer and a second coverlay film stacked in sequence on a second surface of the base film the second coverlay film including a light absorber. The second coverlay film is exposed between the lands and in front of a light emitting surface of the point light source in a light emitting direction.

The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a colour appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a colouring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.

A semiconductor package of an embodiment includes: a wiring substrate having a first surface and a second surface on a side opposite to the first surface; at least one semiconductor chip provided in plurality at different heights from the first surface in a vertical direction; a sealing resin covering the first surface of the wiring substrate and surfaces of the at least one semiconductor chip; a layer formed over a top layer of the at least one semiconductor chip; and an external terminal provided on the second surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal.

An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.