A multilayer substrate that includes a first ceramic layer that is a dense body, a second ceramic layer that has open pores, and a resin layer adjacent the second ceramic layer, wherein a material of the resin layer is present in the open pores of the second ceramic layer.

The present application discloses a filtering cable, which solves the problem that the cable in the related art cannot ensure a simple and reasonable structural design while having good filter performance. One or several core wires and N defective conductor layers surrounding the core wires are sequentially provided from inside to outside in the cross section in the radial direction of the filtering cable; wherein the defective conductor layer has an etching pattern; the etching pattern is distributed in the axial direction of the filtering cable; the etching pattern is used to make the filtering cable equivalent to a preset filter circuit to filter the signal transmitted in the filtering cable.

A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.

To provide a circuit board in which a curvature of a display surface can be controlled, or to provide a highly portable circuit board. A circuit board includes a substrate with flexibility and a curvature control mechanism. The curvature control mechanism includes a first electromagnet and a second electromagnet provided over a first surface of the substrate, an insulating film provided over the first and second electromagnets, and wirings electrically connected to the first and second electromagnets.

A package structure for electronic assemblies includes a porous insulation substrate, a conductive material, a first electronic assembly, and a second electronic assembly. The porous insulation substrate is penetrated with a plurality of through holes, and each of the plurality of through holes has a diameter which is larger than 0 and less than 1 um. The conductive material fills the plurality of through holes. The first electronic assembly is arranged under the porous insulation substrate and electrically connected to the conductive material in the plurality of through holes through at least one first conductive bump. The second electronic assembly is arranged over the porous insulation substrate and electrically connected to the conductive material in the plurality of through holes through at least one second conductive bump to electrically connect to the first electronic assembly.

According to one embodiment, a method of forming a metal foam with substantially uniform density includes forming a metallopolymer network including metallopolymer material with pre-defined ionic conductivity and pre-defined polymeric chain length, adding a reductant to the metallopolymer network during formation thereof for creating metal nanoparticles in the metallopolymer network, where the metal nanoparticles have substantially uniform size, and heating the reduced metallopolymer network for sintering the metal nanoparticles into a network.

A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

A porous polyimide shaped article has a thickness in a range from 550 m to 3,000 m and has a relative dielectric constant of 1.8 or less and a dielectric loss tangent of 0.01 or less at 1 MHz. The porous polyimide shaped article satisfies the following formula:

1.2A1.6

wherein A represents a square root of a ratio of a pore size D.sub.84 where a cumulative percentage by number of pores from smaller sizes is 84% to a pore size D.sub.16 where the cumulative percentage by number of the pores from smaller sizes is 16% ((D.sub.84/D.sub.16).sup.1/2) in a pore size distribution measured by mercury intrusion porosimetry.

A ceramic electronic component that includes a plurality of ceramic layers which are stacked together, and an internal conductor layer disposed between two adjacent ceramic layers among the plurality of ceramic layers, and in which a ceramic layer that is adjacent to the internal conductor layer includes a plurality of pores.

A fabric coated with functional silicone rubber, the fabric being configured such that a coating layer may not be easily separated from the fabric and may be used to form a power line or a signal line. The fabric includes: a woven fabric made by weaving and including uniform pores therein; and a coating layer formed by coating a surface of the woven fabric with liquid silicone rubber in which electrically conductive particles larger than the pores of the woven fabric are dispersed and mixed, wherein the liquid silicone rubber permeates into the pores of the woven fabric by the weight thereof and is cured such that the silicone rubber is anchored to the woven fabric, and an electrically conductive layer having electrical conductivity is formed as the electrically conductive particles are caught on the surface of the woven fabric and increase in density at the surface of the woven fabric.