Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

A conductive adhesive and a bonding method of circuit board are provided. The conductive adhesive includes a substrate and an insulating region formed on a surface of the substrate and a conductive region. The insulating region includes a plurality of insulating retaining walls arranged along a same direction and in intervals. The conductive region includes a plurality of conductive adhesive bodies and the conductive adhesive bodies are filled in gaps between the adjacent insulating retaining walls.

A power-module substrate and a heat sink made of an aluminum-impregnated silicon carbide formed by impregnating aluminum in a porous body made of silicon carbide; where yield strength of a circuit layer is σ1 (MPa), a thickness of the circuit layer is t1 (mm), a bonding area of the circuit layer and a ceramic board is A1 (mm.sup.2), yield strength of a metal layer is σ2 (MPa), a thickness of the metal layer is t2 (mm), a bonding area of the metal layer and the ceramic board is A2 (mm.sup.2); the thickness t1 is formed to be between 0.1 mm and 3.0 mm (inclusive); the thickness t2 is formed to be between 0.15 mm and 5.0 mm (inclusive); the thickness t2 is formed larger than the thickness t1; and a ratio {(σ2×t2×A2)/(σ1×t1×A1)} is in a range between 1.5 and 15 (inclusive).

In some examples, a fluidic conductive trace based radio-frequency identification device may include a flexible substrate layer including a channel, and a trace formed of a conductive fluid that is disposed substantially within the channel. The fluidic conductive trace based radio-frequency identification device may further include a sealing layer disposed on the flexible substrate layer and the trace to seal the conductive fluid in a liquid state within the channel.

An electronic module for a medical device such as an inhaler is disclosed, the electronic module comprising a printed circuit board, and a damper configured to dampen energy transfer to and/or from a battery when a battery is connected to the electronic module and the electronic module is exposed to mechanical shock.

The present disclosure is flexible and stretchable conductive articles that include a printed circuit and a stretchable substrate. The printed circuit contains an electrically conductive trace. The electrically conductive trace may be positioned on the surface of or be imbibed into the pores through the thickness of a synthetic polymer membrane. The synthetic polymer membrane is compressed in the x-y direction such that buckling of the membrane occurs in the z-direction. Additionally, the synthetic polymer membrane may be porous or non-porous. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable substrate. Advantageously, the flexible, conductive articles retain conductive performance over a range of stretch. In some embodiments, the conductive articles have negligible resistance change when stretched up to 50% strain. The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.

The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are ‘wetted’ with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

An electronic assembly includes an elastic substrate, a stretchable conductor layer, an electronic element and a compressible elastic conductor. The stretchable conductor layer is arranged on the elastic substrate, the electronic element is located on one side of the stretchable conductor layer facing away from the elastic substrate, and the stretchable conductor layer is electrically connected to the electronic element. The compressible elastic conductor is at least partially located between the stretchable conductor layer and the electronic element.

To provide a circuit board in which a curvature of a display surface can be controlled, or to provide a highly portable circuit board. A circuit board includes a substrate with flexibility and a curvature control mechanism. The curvature control mechanism includes a first electromagnet and a second electromagnet provided over a first surface of the substrate, an insulating film provided over the first and second electromagnets, and wirings electrically connected to the first and second electromagnets.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).