Patent classifications
H05K2201/012
Prepreg, laminate, metal foil-clad laminate, circuit board and LED module
A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D.sub.50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D.sub.50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.
FLAME-RETARDANT EPOXY RESIN, METHOD FOR PREPARING SAME, AND FLAME-RETARDANT EPOXY RESIN COMPOSITION CONTAINING SAME
This invention relates to a flame-retardant epoxy resin, to a method of preparing the same, and to a flame-retardant epoxy resin composition including the same, and more specifically to a flame-retardant epoxy resin, which satisfies properties while improving flame retardancy by increasing the phosphorus content, to a method of preparing the same, and to a flame-retardant epoxy resin composition including the same.
Conductive-layer-integrated flexible printed circuit board
The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
Halogen-free resin composition and use thereof
The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.
POLYPHENYLENE ETHER MODIFIED PHENOL-BENZALDEHYDE MULTIFUNCTIONAL EPOXY RESIN AND USE
The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I).
##STR00001##
wherein
A is:
##STR00002##
PPE are:
##STR00003##
Z are:
##STR00004##
Y are:
##STR00005##
Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180□, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03 (1 GHz), dissipation factor is 0.0046 (1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.
RESIN COMPOSITION, COPPER-CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME
A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATED BOARD PREPARED THEREFROM
A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
Aerosol generating device including detachable vaporizer
An exemplary embodiment of the present disclosure provides an aerosol-generating device including a case into which a cigarette is insertable, a vaporizer detachably combined with the case, and a detachment manipulation unit installed in the case and configured to perform, according to user manipulation, a first operation of maintaining a state in which the vaporizer is combined with the case and a second operation of allowing separation of the vaporizer from the case.
Method and system for providing dynamic personalized recommendations for a destination
Methods and systems for providing a user with content relevant to a location of interest to the user, when the user is determined to be at or near the location, are presented. The user's interest in the location may be determined based on queries about the location received from the user prior to the user arriving at the location. The queries received from the user about the location are used to build a location recommendation model, which generates personalized content relevant to the location and to one or more interest verticals identified for the user. The location recommendation model is built using a location recommendation engine that collects data about the user, the queried location, one or more associations between the user, the queried location, and/or one or more other users, as well as various other information related to the user's interests and the queried location.
Aerosol generating device and method for controlling same
An aerosol generating device includes: a case into which a cigarette is to be inserted; a cap detachably coupled to a top portion of the case; a cover configured to slide on a top surface of the cap so as to open or close a cigarette insertion hole; a first sensor configured to sense whether the cigarette insertion hole is open or closed; and a controller configured to determine whether the cigarette insertion hole is open or closed based on a signal sensed by the first sensor and set an operational mode of the aerosol generating device as an ON mode or an OFF mode based on a result of the determining.