The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 m or more and 300 m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200 C. as measured by a TMA method according to JIS K7197 are each within a range of 30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation 1(%) of a film surface S1 exposed and a degree of orientation 2(%) of a film surface S2 located at a depth of 5 m from the film surface S1 satisfy a relationship of 4.0[(21)/1]1000.0; (B) a hardness H1 at a point of a depth of 1 m located at a position of 1 m from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy 10.0100(H2H1)/H10.0.

A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

A lighting rope for an accessory includes a power control unit, a rope sleeve, and a flexible printed circuit board provided inside and extending along the rope sleeve. The flexible printed circuit board is sleeved with the rope sleeve by using a heat shrinkable film wrapping process. The flexible printed circuit board is provided in a length direction with a plurality of light-emitting diodes (LEDs) arranged at intervals. The power supply control unit includes a push button and a power supply battery. The LEDs are powered by the power supply battery and controlled by the push button to emit light. A semiconductor process is used to mount the LEDs on the flexible printed circuit board and the heat shrinkable film wrapping process is used to wrap the rope sleeve outside the flexible printed circuit board, greatly reducing the diameter of the existing lighting rope.

The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 m or more and 300 m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200 C. as measured by a TMA method according to JIS K7197 are each within a range of 30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation 1(%) of a film surface S1 exposed and a degree of orientation 2(%) of a film surface S2 located at a depth of 5 m from the film surface S1 satisfy a relationship of 4.0[(21)/1]1000.0; (B) a hardness H1 at a point of a depth of 1 m located at a position of 1 m from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy 10.0100(H2H1)/H10.0.

A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.

The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 m or more and 300 m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200 C. as measured by a TMA method according to JIS K7197 are each within a range of 30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation 1(%) of a film surface S1 exposed and a degree of orientation 2(%) of a film surface S2 located at a depth of 5 m from the film surface S1 satisfy a relationship of 4.0[(21)/1]1000.0; (B) a hardness H1 at a point of a depth of 1 m located at a position of 1 m from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy 10.0100(H2H1)/H10.0.

The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 m or more and 300 m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200 C. as measured by a TMA method according to JIS K7197 are each within a range of 30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation 1 (%) of a film surface S1 exposed and a degree of orientation 2 (%) of a film surface S2 located at a depth of 5 m from the film surface S1 satisfy a relationship of 4.0[(21)/1]1000.0; (B) a hardness H1 at a point of a depth of 1 m located at a position of 1 m from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy 10.0100(H2H1)/H10.0.

The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 m or more and 300 m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200 C. as measured by a TMA method according to JIS K7197 are each within a range of 30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation 1(%) of a film surface S1 exposed and a degree of orientation 2(%) of a film surface S2 located at a depth of 5 m from the film surface S1 satisfy a relationship of 4.0[(21)/1]1000.0; (B) a hardness H1 at a point of a depth of 1 m located at a position of 1 m from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy 10.0100(H2H1)/H10.0.