A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.

A compound (A) of the present invention is represented by the formula (1): wherein each R.sub.1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R.sub.2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R.sub.1 is a group represented by the formula (2); and wherein -* represents a bonding hand.

A method for producing a panel with integrated conductor tracks and electronic components. The panel includes a panel body, wherein the panel body is in particular a sandwich structure, and a membrane. The membrane is connected to the panel body and has integrated conductor tracks and electronic components. At the beginning of the method, an operation for attaching the conductor tracks and the electronic components to the membrane is provided. The subsequent step includes an operation for connecting the membrane, fitted with the conductor tracks and the electronic components, to the panel body.

One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.

A leadwire for physiological patient monitoring is provided that transfers potentials received at a chest electrode to a data acquisition device. The leadwire includes an electrode end connectable to the chest electrode and a first conductive layer extending from the electrode end. The leadwire also has a device end connectable to a data acquisition device and a second conductive layer extending from the device end. The first conductive layer is galvanically isolated from the second conductive layer such that the first conductive layer and the second conductive layer form a capacitor.

It would be helpful to provide a styrene-based resin molded body that has excellent dielectric constant, dielectric loss tangent, and color tone, and with little degradation in properties due to usage environment. The present disclosure is a styrene-based resin composition containing a styrene-based resin (A1) having styrene-based monomer units as repeating units. The styrene-based resin composition includes 6 μg or less of a catechol derivative contained in the styrene-based resin (A1) per gram of the styrene-based resin (A1), and the total amount of dimers of the styrene-based monomer units and trimers of the styrene-based monomer units contained in the styrene-based resin (A1) is 5000 μg or less per gram of the styrene-based resin (A1). The styrene-based resin composition has a dielectric constant of 3 or less and a dielectric loss tangent of 0.02 or less.

A manufacturing method includes stacking, between two endless belts, a first sheet of metal foil, a plurality of insulating films, and a second sheet of metal foil in this order one on top of another and hot-press molding these sheets and films together to form an insulating layer out of the plurality of insulating films. Each of the plurality of insulating films has a first surface and a second surface. The second surface has a larger ten-point mean roughness (Rzjis) than the first surface. The absolute value of difference between a ten-point mean roughness (Rzjis) of a surface, in contact with the first sheet of metal foil, of the insulating layer and a ten-point mean roughness (Rzjis) of another surface, in contact with the second sheet of metal foil, of the insulating layer is equal to or less than 0.35 μm.

Methods and systems for creating a device having a switch trace are disclosed. The systems and methods described herein may include a device that has a chassis, the chassis having a top and a bottom, at least one antenna affixed to the top of the chassis, a first laser direct structuring-fabricated (LDS) trace, a second LDS trace, and a button, the button connected to the first LDS trace and the top of the chassis, wherein the button is configured to contact the second LDS trace when the button is depressed and complete a circuit between the first LDS trace and the second LDS trace upon contact.

A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.