The laminate includes a multilayer polyimide film having thermoplastic polyimide layers on both sides of a core layer which is a non-thermoplastic polyimide film and a surface layer contacting the thermoplastic polyimide layer on one surface-side of the multilayer polyimide film. The surface layer may be an inorganic layer having a thickness of 1 to 200 nm or a resin layer having a thickness of 0.1 to 5 μm. A single-sided metal-clad laminate is formed by laminating a metal layer on the thermoplastic resin layer on the surface layer non-formed surface of the laminate.

In order to maintain high haze value of thermoplastic liquid crystalline polymer while to improve total light transmittance, provided is a thermoplastic liquid crystalline polymer molded body having a haze value of 99% or higher, and a thermal expansion coefficient of 16 to 27 ppm/° C., and satisfying a correlation between a light absorption coefficient (ε) and a thickness (x) as: ε≤0.21x.sup.−0.55.

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

A process for manufacturing an electrically conducting device from lignocellulosic material comprises the following steps: impregnating (S10) the lignocellulosic material with at least one filling compound so as to produce a composite substrate; and depositing (S12) at least one conducting layer on at least one surface of the composite substrate so as to produce an electrically conducting device.
Use of an electrically conducting device so produced for example particularly as a touch interface.

The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).

A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.

The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m.K measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m.Math.K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.