The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

A laser platable thermoplastic composition includes from about 38 wt % to about 90 wt % of a thermoplastic polymer, from about 0.01 wt % to about 15 wt % of a laser activatable metal compound, and from about 0.01 wt % to about 60 wt % of a magnetic filler. The magnetic filler includes a magnetic alloy. Methods for making laser platable thermoplastic compositions and articles formed therefrom—such as an induction heater for a domestic or commercial appliance—are also described.

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

A multilayer resin substrate includes a stacked body including resin layers stacked on each other, a first planar conductor on a resin layer, and an interlayer connection conductor on a resin layer. The interlayer connection conductor includes a first interlayer connection conductor connected to an external conductor, and a second interlayer connection conductor bonded to the first interlayer connection conductor and a planar conductor. The first and second interlayer connection conductors are made of different materials. The second interlayer connection conductor includes a constricted portion including a smaller planar cross-sectional area than a different portion, between a bonding portion to which the first interlayer connection conductor is bonded and a bonding portion to which the planar conductor is bonded.

This disclosure relates to embodiments of work vehicle systems including multilayer wiring panels (MWPs), which provide electrical interconnections to various electronic devices integrated into the work vehicle system. In embodiments, a work vehicle system includes a work vehicle component having a component housing which a first MWP is mounted. The first MWP includes a multilayer panel body having a non-planar cross-sectional shape generally conformal with a topology of a non-planar mounting surface of the component housing, preplaced wires embedded in the multilayer panel body, and panel input/output (I/O) interfaces electrically connected by the preplaced wires. The panel I/O interfaces contain first and second panel I/O interfaces electrically coupled to the controller and to the first integrated electronic device, respectively, such that the controller is placed in signal communication with the first integrated electronic device through the first MWP during operation of the work vehicle system.

Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.

The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Disclosed are insert-molded electronic modules that include an electrical/electronic component and a heat sink that interlocks with, and optionally also encapsulates, the electrical/electronic component to provide thermal management for the component. The heat sink is formed using a thermally conductive thermoplastic polymer composition and replaces the potting compound and thermal interface material typically used in such assemblies. The electrical/electronic component includes openings that allow the thermally conductive thermoplastic polymer composition to flow therethrough and interlock with the electrical/electronic component. The electronic module may include an insert positioned between the electrical/electronic component and the heat sink, wherein the insert includes holes that allow the conductive thermoplastic polymer composition to flow therethrough and interlock with the insert.