The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

According to one embodiment, an electronic device includes an insulating base having elasticity, a plurality of lines provided on the insulating base, and a plurality of electric elements connected to the lines. The insulating base includes island-shaped portions in which the electric elements are located, and band-like portions in which the lines are provided and which connect the adjacent island-shaped portions. The band-like portions includes a curved portion which meanders, and a straight line portion which connects the curved portion and the island-shaped portion. The curved portion includes a first curved portion, a second curved portion and a third curved portion. A width of the second curved portion is less than a width of the third curved portion.

A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ρ/ρ.sub.0 of the specific electrical resistance ρ of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (Ω.Math.cm) ρ.sub.0 of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.

The invention relates to an electrically conductive film (10) having an electrically nonconductive substrate layer (12), and an electrically conductive metal layer (14) that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (12).

A substrate for use in an electronic skin is disclosed herein. The substrate comprises a base polymer layer, and a first intermediate polymer layer attached to the base polymer layer by a first adhesive layer. The first intermediate polymer layer comprises a first intermediate polymer in which electron-rich groups are linked directly to one another or by optionally substituted C.sub.1-4 alkanediyl groups. A first conductive layer is attached to the first intermediate polymer layer by a second adhesive layer or by multiple second adhesive layers between which a second intermediate polymer layer or a second conductive layer is disposed.

An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

A variable-stiffness module comprises a rigid structure (10) having a first stiffness, an intermediate substrate (20) having a second stiffness less than the first stiffness, and a flexible substrate (30) having a third stiffness less than the second stiffness. The rigid structure (10) is disposed on the intermediate substrate (20) and the intermediate substrate (20) is disposed on the flexible substrate (30). A conductor (40) is disposed partially on the intermediate substrate (21) and partially on the flexible substrate (30) and connected to the rigid structure (10). The conductor (40) extends from the rigid structure (10) to the intermediate substrate (21) to the flexible substrate (30). In some embodiments, a variable-stiffness module comprises any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor (40) can be an optical conductor or an electrical conductor and can be disposed over the rigid structure (10) or between the rigid structure (10) and the intermediate substrate (21).