The present application discloses a stretchable electrode, an electronic device and a manufacturing method thereof. The stretchable electrode includes a substrate, an electric conductive area and an electronic device integration area; the substrate has a first elastic layer and a second elastic layer with different elastic moduli. The electronic device produced by using the afore-mentioned stretchable electrode can be stretched entirely, and when it is stretched, the electronic device would not be damaged and the variation of its impedance is small. Tests have shown that the electric conductive layer can be stretched by more than 20%, with the variation ratio of its impedance being less than 1.5%, and no damage is caused to the electronic device.

A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 μm.

One or more embodiments of the present disclosure provides a stretchable display device. The stretchable display device includes a lower substrate including a display area and a non-display area, a plurality of first substrates and a plurality of second substrates disposed in the display area, a plurality of light emitting elements disposed on each of the plurality of first substrates, a switching transistor and a driving transistor disposed on each of the plurality of second substrates, in which the switching transistor may output a data signal to the driving transistor in accordance with a scan signal and the driving transistor may output a driving current to the light emitting element in accordance with the data signal.

A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Disclosed is a stretchable substrate including: a via configured to provide an electrical connection between one surface and the other surface of the stretchable substrate; and a buffer shell positioned between the via and the stretchable substrate and having a Young's modulus value that is greater than a Young's modulus value of the stretchable substrate and smaller than a Young's modulus value of the via.

A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

A system and method for fabricating an orifice in a multi-layered semiconductor substrate and singulation of the semiconductor substrate includes adding a sacrificial layer of material to a first surface of a semiconductor substrate; subsequently, removing a first radius of a first depth of material from the semiconductor substrate along a direction normal to the first surface, the removal of the first depth of material uses a first removal technique that removes the first depth of material; and removing a second radius of a second depth of material from the semiconductor substrate along the direction normal to the first surface based on the removal of the first depth of material, the removal of the second depth of material uses a second removal technique.

Provided is stretchable electronics. The stretchable electronics includes stretchable substrate, first support patterns disposed on a first surface of the stretchable substrate, and output devices disposed on the first patterns, respectively. The first support patterns are arranged in a first direction and a second direction, which are parallel to an extension direction of the substrate, and each of the output devices generates an output stimulation.

A method for fabricating an orifice in a semiconductor which can include: removing a first depth of the semiconductor using a first material removal technique and removing a second depth of the semiconductor using a second material removal technique. The method can optionally include: adding a sacrificial layer of material and reducing a depth of the semiconductor by a friction-based material removal technique. In examples, the method fabricates a wafer-scale processor with a set of fastening features.

Disclosed is a flexible and stretchable electronic device based on a biocompatible film. The biocompatible film is utilized as an encapsulation layer and a substrate layer of the device; a bonding layer is provided between the encapsulation layer and a functional layer; and an adhesion layer is arranged under the substrate layer. The functional layer employs a flexible and stretchable structure. Solution-based transfer printing technology is primarily used during the preparation of such a device to achieve integration of the functional layer and the flexible substrate layer. This device retains and even enhances the flexibility and stretchability structurally. Meanwhile, the biocompatibility properties thereof, such as being waterproof and air permeable, hypoallergenic, etc., allow it to work normally on the human body surface for more than 24 hours without foreign body sensation and discomfort, and thus, skin maceration, redness or other allergic reactions due to poor biocompatibility can be avoided.