A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm.sup.2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6B/A1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100 C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

An extensible electroconductive wiring material includes a flexible electroconductive material and insulating elastic bodies and, wherein the flexible electroconductive material having an electroconductive layer has vent peripheral edge portions in which vent holes and/or vent slits are penetrated and aligned in series and/or in parallel along an energization direction of the electroconductive layer while the vent peripheral edge portions are energizably linked, and the vent peripheral edge portions is sealed and covered by the insulating elastic bodies, so as not to be exposed; and the insulating elastic bodies, have penetration slits, and/or penetration holes which penetrate therethrough while matching the vent peripheral edge portions and are smaller than the vent holes and the vent slits. The extensible electroconductive wiring module has a plurality of these extensible electroconductive wiring materials.

Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 m to 3 m.

A wiring board includes: a flexible printed circuit board that includes: a base having a first opening; a wiring pattern formed on the base; and a cover lay that includes an adhesive layer adhering to the wiring pattern and that has a second opening; and a metal cover that covers at least a part of the first opening from below. The wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover. At least a part of the second opening overlaps the first opening in a plan view. A part of the cover lay overlaps the first opening in a plan view.

Provided is a bidirectional neural interface having excellent elasticity and electrical conductivity improved by deformation, and further having self-healability and a method of manufacturing the same. The bidirectional neural interface includes a first elastic substrate, a neural electrode disposed on the first elastic substrate and including a conductive polymer composite, and a second elastic substrate disposed on the neural electrode, wherein the conductive polymer composite includes a matrix formed of a self-healing polymer material, and a plurality of electrical conductor clusters distributed in the matrix, wherein each of the electrical conductor clusters includes particles of a first electrical conductor, and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor and having smaller sizes than sizes of the particles of the first electrical conductor.

A stretchable contractible wiring sheet includes: stretchable contractible first elastomer sheet; stretchable contractible second elastomer sheet facing and bonded on the first elastomer sheet, and lead that has a transverse section having any cross-sectional shape selected from circular shape, elliptical shape, and track shape, and is plastically deformed in wavy shape periodically curving along longer direction, the lead being interposed between the first elastomer sheet and the second elastomer sheet in a manner that height direction of waves in wavy shape is along in-plane direction of facing surfaces of the first elastomer sheet and second elastomer sheet. The wiring sheet that can be produced easily at low costs, has high flexibility and durability, and undergoes small resistance value change along with stretching and contracting, and stretchable contractible touch sensor sheet.

Various embodiments are directed to a method of forming an apparatus including placing a first electronic circuit in contact with a second electronic circuit, wherein each of the first and second electronic circuits have connector circuits configured and arranged to provide an electrical connection between the first and second electronic circuits and are formed with a polymer film that is configured to adhere, via self-healing, to another polymer film. The method further includes, in response to the contact, causing or facilitating the self-healing of the respective polymer films of the first and second electronic circuits, thereby creating the electrical connection therebetween.

The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.

A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

A light system includes a first substrate and a second substrate having the first substrate thereon. A light emitting diode (LED) is connected to the first substrate. An encapsulation layer covers the LED and at least a majority of the first substrate.