A method is provided for forming an internal electromagnetic interference (EMI) shield in a mold cap formed over a printed circuit board (PCB). The method includes forming a trench in the mold cap, the trench extending continuously from a first edge of the mold cap to a second edge of the mold cap, where the trench defines a trench pattern corresponding to desired locations of the internal EMI shield. The method further includes sealing an elastomeric pad on a top surface of the mold cap to form a channel, the channel including at least the trench formed in the mold cap; and filling the channel with a conductive epoxy using a vacuum configured to draw the conductive epoxy from a dispenser, connected to the first edge of the mold cap, through the channel to the second edge of the mold cap based on pressure differential.

The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m.K measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m.Math.K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.

Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

A device for manufacturing a stretchable substrate structure according to an embodiment includes a carrier substrate receiving portion configured to receive a carrier substrate therein, a stretchable substrate receiving portion configured to receive a stretchable substrate in a direction facing the carrier substrate, and a diaphragm configured to be deformed by air pressure provided on one surface, wherein the diaphragm comes in contact with an entire surface of the stretchable substrate in a plane direction when deformed, such that the stretchable substrate is combined to the carrier substrate by deforming according to the deformed shape of the diaphragm.

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.

A backlight device 12 includes at least: a plurality of LEDs 17 arranged in an annular and curved shape; a light guide plate 14 surrounded by the plurality of LEDs 17 having am outer shape along the arrangement of the plurality of LEDs 17, and guiding light from the plurality of LEDs 17; and an LED board (light source board) 18 on which the plurality of LEDs 17 are mounted and wiring portions 18c for feeding power to the plurality of LEDs 17 are formed. The LED board 18 extends along the arrangement of the plurality of LEDs 17, and has a terminated annular shape or an endless annular shape, and includes a no-wiring formed region NWA in a part with respect to the circumferential direction thereof, where the wiring portions 18c are not formed.

Disclosed is a flexible and stretchable electronic device based on a biocompatible film. The biocompatible film is utilized as an encapsulation layer and a substrate layer of the device; a bonding layer is provided between the encapsulation layer and a functional layer; and an adhesion layer is arranged under the substrate layer. The functional layer employs a flexible and stretchable structure. Solution-based transfer printing technology is primarily used during the preparation of such a device to achieve integration of the functional layer and the flexible substrate layer. This device retains and even enhances the flexibility and stretchability structurally. Meanwhile, the biocompatibility properties thereof, such as being waterproof and air permeable, hypoallergenic, etc., allow it to work normally on the human body surface for more than 24 hours without foreign body sensation and discomfort, and thus, skin maceration, redness or other allergic reactions due to poor biocompatibility can be avoided.

Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.

An electronic circuit may include an elastomeric substrate with an electronic die attached to the elastomer substrate at a first substrate area and one or more meander traces electrically coupled to the electronic die and encapsulated in the elastomer substrate at a second substrate area that is adjacent to the first substrate area. An inelastic, non-electronic, structural brace may be attached to the elastomeric substrate in the first substrate area.

A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.