A phototherapy device includes at least one flexible sheet that has first and second electrical conduction layers, an electrical insulation layer between the first and second electrical conduction layers, and light emitting diodes (LEDs) disposed along the electrical insulation layer between the first and second electrical conduction layers. The first electrical conduction layer includes a conductive polymer. The electrical conduction layers and the LEDs are part of an electrical circuit in which the LEDs illuminate responsive to an electrical input. There is at least one meter to measure an electrical property of the electrical circuit. A control module is in communication with the meter and configured to adjust the electrical input responsive to the electrical property of the electrical circuit.

A method of potting e.g. a stack of printed circuit boards, the method comprising applying a first potting material to selected regions of the circuit to be potted and then applying a second, different, potting material over the circuit to be potted.

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

This wiring board includes a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate.

An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.

According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, a light emitting diode (LED) mounted to the circuit board and configured to emit light, a lens disposed over the LED having a bottom surface facing the circuit board, a top surface opposite the bottom surface, and a lateral surface between the top and bottom surfaces, and an elastomer encapsulating at least part of the circuit board. The elastomer may not be in contact with at least part of the lateral surface of the lens so as to form a gap between the elastomer and the lateral surface of the lens.

A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.

An elastic wiring board that includes an elastic substrate; a plurality of electrode wirings having elasticity; and an ion-migration resistant layer between at least a first electrode wiring of the plurality of electrode wirings and the elastic substrate.

An optical unit with a shake correction function includes a movable module and a fixed body. The movable module has a lens and is supported by the fixed body to be capable of moving in a direction orthogonal to an optical axis of the lens. The fixed body surrounds the movable module from an outer periphery side. The movable module includes a first substrate and a second substrate, with a thickness direction of either substrate being consistent with the direction along the optical axis. An image sensor is disposed on the first substrate. The second substrate is electrically connected to the first substrate to overlap the first substrate on an image side, and is smaller in shape than the first substrate when viewed along the optical axis of the lens. A flexible printed circuit board is led out from an outer circumferential surface of the second substrate.

A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.