Provide is a metal-coated liquid-crystal polymer film that is suitable for microcircuit processing and capable of reducing the transmission loss of circuits. The metal-coated liquid-crystal polymer film comprising: a polymer film comprising a polymer film main body capable of forming an optically anisotropic melt phase; a first metal layer layered on at least one side of the polymer film main body; and a second metal layer layered on the first metal layer, wherein in an analysis of oxygen concentration in a thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atom % or less.

A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

A thermoplastic composition includes: (a) poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) at least 10 wt % of a reinforcing filler comprising glass fiber; (c) a laser direct structuring (LDS) additive comprising a tin oxide, an antimony oxide, or a combination thereof; and (d) a reflection additive comprising a titanium compound. A weight ratio of total titanium in the composition to the LDS additive in the composition is at least 0.7:1, or a weight ratio of total titanium in the composition to the PCT is 1.1:1 or less.

A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3≤SR4<SR2 is satisfied.

A multilayer substrate includes a resin multilayer body including, in a lamination direction, first and second laminate portions respectively including first and second thermoplastic resin layers, and a first interlayer connection conductor extending through the first thermoplastic resin layer. A storage elastic modulus of the first thermoplastic resin layer is lower than that of the second thermoplastic resin layer at a measurement temperature equal to or higher than a minimum melting point among melting points of metallic elements included in the first interlayer connection conductors and equal to or lower than melting points of the first thermoplastic resin layer and the second thermoplastic resin layer.

A flexible printed circuit board with a multi-layer all solid-state lithium ion battery printed thereon is described. A flexible printed circuit board comprises at least one electrically insulating liquid crystal polymer or polyimide layer and at least one electrically conductive metal layer. The multi-layer all solid-state lithium ion battery comprises at least one anode, at least one cathode, and at least one UV curable solid electrolyte therebetween. The battery is encapsulated between the flexible printed circuit board and a layer of laminated aluminum foil on top of the multi-layer all solid-state lithium ion battery and adhered directly to the flexible printed circuit board.

An object of the present invention is to provide a polymer film, in which in a case where a laminate is manufactured by sticking a metal foil to the polymer film, the adhesiveness between the polymer film and the metal foil is excellent, and the performance of suppressing a misregistration of a wiring line formed on the metal foil is excellent even in a case of further laminating a sticking material on the wiring line; and a laminate.

A polymer film including a liquid crystal polymer, in which in a case where an elastic modulus at a position A at a distance of half of a thickness of the polymer film from one surface toward the other surface of the polymer film is defined as an elastic modulus A and an elastic modulus at a position B at a distance of ⅛ of the thickness of the polymer film from one surface toward the other surface of the polymer film is defined as an elastic modulus B in a cross-section along a thickness direction of the polymer film, a ratio B/A of the elastic modulus B to the elastic modulus A is 0.99 or less and the elastic modulus A is 4.0 GPa or more.

A metal foil layer includes a metal foil layer upper main surface, a metal foil layer lower main surface with a surface roughness greater than that of the metal foil layer upper main surface, and a metal foil layer side surface that is a surface of the metal foil layer excluding the metal foil layer upper main surface and the metal foil layer lower main surface. The metal foil layer upper main surface is in contact with an upper resin layer. The metal foil layer lower main surface is in contact with a lower resin layer. A portion of a lower main surface of the upper resin layer and a portion of an upper main surface of the lower resin layer are in contact with each other to define a layer interface. In a cross section of the metal foil layer, the metal foil layer side surface includes an outer point and an inner point where the upper resin layer is in contact with the side surface, and the inner point is below the outer point and inward of the outer point.