A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10.sup.6 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: ##STR00001##
where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

A fluororesin film including a fluorine-containing composition, wherein the oxygen element percentage as measured when heat treatment is performed at 180° C. for 3 minutes and then the state of one or both surfaces of the film is observed by scanning X-ray photoelectron spectroscopy (XPS/ESCA) is 1.35 atom % or more, and an absolute value of the rate of dimensional change in MD and TD before and after heat treatment as measured when the film is heat-treated at 180° C. for 10 minutes and then cooled to room temperature is 2% or less. Also disclosed is a copper-clad laminate, including copper foil and the fluororesin film; a substrate for circuit, including the copper-clad laminate; and a method for producing the copper-clad laminate.

A substrate with a conductive layer including a substrate, which is a woven or nonwoven fabric containing polytetrafluoroethylene (PTFE) nanofibers; and a conductive layer formed on the substrate, the conductive layer being formed from a conductive composition with a viscosity in a range of 1 to 500 Pa.Math.s measured at 25° C. with a rotational viscometer at a rotational speed of 50 rpm, wherein the following requirement (1) is satisfied: requirement (1); the substrate with a conductive layer has a Gurley permeability of 10 s/100 ml or less.

A flexible circuit board and a display panel are provided. The flexible circuit board includes a circuit board substrate layer, devices, a fluorinated-liquid solidification layer, and an insulating film. The devices are disposed on the circuit board substrate layer. Surfaces of the devices away from the circuit board substrate layer are covered with fluorinated liquid. The insulating film includes an insulating film substrate layer and a fluorine-containing adhesive layer. The fluorine-containing adhesive layer includes a resin adhesive and a fluorine-containing substance, and is in contact with the fluorinated liquid.

A transparent conductive film (10) that has a substrate (14) having a surface (14a, 14b), a nanowire layer (12, 12a) over one or more portions of the surface (14a, 14b) of the substrate (14), and a conductive layer (16, 16a) on the portions comprising the nanowire layer (12, 12a), the conductive layer (16, 16a) comprising carbon nanotubes (CNT) and a binder.