A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

A film 1 for a metal layer laminate board is used for lamination of a metal layer 5. The film 1 for a metal layer laminate board includes a porous resin layer 2 and a skin layer 3 in order in a thickness direction. The porous resin layer 2 has an average pore size W in the entire thickness direction of 7.0 μm or less. The porous resin layer 2 includes a first region 11 to a fifth region 15 disposed in order in a direction away from the skin layer 3 when the porous resin layer 3 is equally divided into five in the thickness direction. A ratio (A1/A5) of an average pore size A1 of the first region 11 to an average pore size A5 of the fifth region 15 is 0.45 or more and 1 or less.

Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.

In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can comprise at least one of 20 to 45 volume percent of the fluoropolymer, 15 to 35 volume percent of the plurality of boron nitride particles, 1 to 32 volume percent of the plurality of titanium dioxide particles, 10 to 35 volume percent of the plurality of silica particles, and 5 to 15 volume percent of the reinforcing layer; wherein the volume percent values are based on a total volume of the dielectric layer.

A laminated plate has a metallic conductive layer layered on one surface or each surface of an insulating substrate, the insulating substrate contains a fluorine resin and a polymer of an alkoxysilane, and the fluorine resin is dispersed in the polymer of the alkoxysilane.

Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes coating a first side of a flexible wound contact layer of the wound dressing with a hydrophobic coating. The first side of the wound contact layer can support a plurality of electronic components. The method can further include coating a second side of the wound contact layer opposite the first side with the hydrophobic coating. The wound contact layer can be formed at least partially from hydrophilic material.

A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer.

A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), ##STR00001##
wherein, R.sup.11 to R.sup.16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

To provide a glass resin laminate of the present invention, in which the glass substrate and the resin layer containing a TFE polymer are strongly laminated, is hardly warped and is excellent in the electrical properties, a composite laminate further having a metal foil, and methods for producing them. A glass resin laminate comprising a glass substrate 10 having an uneven surface 12 with an arithmetic mean roughness of at least 5 nm, and a resin layer containing a tetrafluoroethylene polymer in contact with the uneven surface 12, wherein the uneven surface 12 has specific convex portions 21 and 22 which narrow at at least a part of the root portion as compared with the tip portion.