A wiring board, comprising: wiring patterns that are buried with the wiring board, in which at least one of thickness regions to a thickness position of 7 μm toward a direction away from the wiring patterns with each of one surface and the other surface of the wiring pattern in a thickness direction as a reference has an elastic modulus at 240° C. equal to or greater than 300 MPa, and a dielectric loss tangent is equal to or less than 0.006.

A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.

A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

A wiring circuit board includes a base insulating layer, a first wiring layer disposed at one side in a thickness direction of the base insulating layer, and a cover insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first wiring layer. The first wiring layer includes a first wiring portion in contact with one surface of the base insulating layer, and a second wiring portion in contact with one surface in the thickness direction of the first wiring portion. Both end surfaces in a width direction perpendicular to the thickness direction and a transmission direction of the second wiring portion are disposed inside in the width direction with respect to both end surfaces of the first wiring portion.

A wiring circuit board includes a porous insulating layer, and a first conductive layer sequentially toward one side in the thickness direction. The first conductive layer includes a first signal wire and first ground wires. Each of the first ground wires is thicker than the first signal wire.

A multilayer circuit board including a ceramic substrate part and a unit circuit board coupled to one surface of the ceramic substrate part. The unit circuit board includes an insulating layer with a circuit pattern formed on one side, an adhesive layer adhered to another surface of the insulating layer, a via hole passing through the insulating layer and the adhesive layer and connected to one surface of the circuit pattern, and conductive paste filled in the via hole.

A manufacturing method including batch bonding a circuit board part, which includes a plurality of unit circuit boards, and a ceramic substrate part, wherein each unit circuit board includes providing an insulating layer having a circuit layer, forming an adhesive layer on the insulating layer, forming a circuit pattern, forming a via hole in the insulating and adhesive layers, and filling the via hole with conductive paste.

A wiring substrate includes an insulating layer including resin and filler particles, conductor layers including an upper-layer conductor layer and a lower-layer conductor layer such that the insulating layer is sandwiched between the upper-layer and lower-layer conductor layers, and a penetrating conductor formed in the insulating layer such that the penetrating conductor is penetrating through the insulating layer and connecting the upper-layer and lower-layer conductor layers. The penetrating conductor is formed such that the penetrating conductor has a first length which is the maximum width of the penetrating conductor in the direction orthogonal to the thickness direction of the wiring substrate and the first length is 25 μm or less, and the insulating layer is formed such that the maximum particle size of the filler particles in a region within the distance of 40% of the first length from the penetrating conductor is 20% or less of the first length.

Disclosed are a method of directly patterning a stretchable substrate; and a stretchable electrode fabricated by the method. More particularly, the method of directly patterning a stretchable substrate includes: forming a hydrophilic group on a surface of a stretchable substrate by UV-ozone treatment; forming at least one layer to be etched on the hydrophilic group-formed stretchable substrate, wherein the at least one layer to be etched includes an adhesion enhancing material; forming a photoresist layer on the at least one layer to be etched; exposing the photoresist layer; and patterning the at least one layer to be etched using the exposed photoresist layer, wherein a carbon chain included in the adhesion enhancing material forms ether bonding (R—O—R) with a hydrophilic group formed on the surface of the stretchable substrate.

Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.