The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.

An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.

Dynamic pattern transfer printing systems and method are provided, which decouple the design of the trench patterns on a source substrate for pattern transfer printing, from the resulting metallic paste lines patterns transferred to a receiving substrate, such as PV cells. The receiving substrate may be moved forward (along the scanning direction of the laser illumination used to transfer the paste from the trenches onto the receiving substrate) to reduce the pattern pitch with respect to the source substrate, and/or the receiving substrate may be moved backward (against the scanning direction) to increase the pattern pitch with respect to the source substrate. For example, dynamic pattern transfer printing may be used to accommodate different widths of the substrates for more effective pattern transfer, and/or to enable one-to-many pattern transfer technologies with high wafer throughput. Also, pattern transfer sheet with separate multiple groups of trenches are provided.

The present disclosure relates to a polyimide-based polymer film comprising a polyimide-based polymer containing a polyimide repeating unit synthesized by the reaction of an acid anhydride compound having a specific structure and a diamine compound, wherein an average transmittance at a wavelength of 380 nm or more and 780 nm or less is 60% or more, and a thickness direction retardation value at a thickness of 10 pm is 150 nm or less, and a substrate for a display device, a circuit board, an optical device, and an electronic device using the same.

A flexible wiring board that includes a flexible substrate; a flexible wiring over the flexible substrate; and a protective layer over the flexible substrate, where the protective layer includes: a first region that overlaps with the flexible wiring and a second region that does not overlap with the flexible wiring as viewed from a thickness direction of the flexible substrate, and a low flexibility part that is higher in flexibility ratio than the first region and is disposed along an extending direction of the flexible wiring in the second region.

Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.

A flexible printed circuit board includes: a proximal end portion; a left strip portion and a right strip portion that extend in the rear direction from the proximal end portion; and conductive paths, a portion of which is provided spanning from the proximal end portion to the left strip portion, and another portion of which is provided spanning from the proximal end portion to the right strip portion. In portions of the conductive path in the left strip portion and the right strip portion, strip side connecting portions that are electrically connected to electrode terminals of electricity storage devices are provided. In the left strip portion, a deformation portion that deforms to increase the distance between the left strip portion and the right strip portion is provided.

A display panel including a substrate, multiple display pixels, an encapsulation structure, and an auxiliary layer is provided. The substrate includes a display region, a bendable region, and a buffer region positioned therebetween. The display pixels are disposed in the display region. The encapsulation structure is overlapped with the display region and covers the display pixels. The auxiliary layer is overlapped with the bendable region and has a top surface. A first height is included between a top surface of the auxiliary layer and a surface of the substrate. The auxiliary layer and the encapsulation structure define a recess overlapped with the buffer region. A second height is included between a bottom surface of the recess positioned in the buffer region and the surface of the substrate. A difference between the first height and the second height is greater than 0 μm and less than or equal to 4 μm.

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.