A photosensitive dry film and uses of the same are provided. The photosensitive dry film comprises a support layer and a photosensitive resin layer disposed on the support layer, wherein the support layer has a first surface and a second surface opposite the first surface, and the first surface is in contact with the photosensitive resin layer and has a non-smooth structure.

A trim element includes at least one support layer having an inner face and an outer face and at least one functional layer of carbon material extending over at least part of the inner face and/or over at least part of the outer face of the support layer. A part of the functional layer defines a pattern having at least one conductive area of carbon material and at least one non-conductive area formed by a through-opening in the functional layer, the conductive area being powered by a current source electrically connected to the conductive area, the pattern forming at least a part of an electrical circuit arranged to perform a function.

Provided is a film including a thermoplastic resin, in which a relative permittivity of the film at a frequency of 1 GHz is 3 or less, a dielectric loss tangent of the film at a frequency of 1 GHz is 0.005 or less, and a molecular orientation (MOR) value of the film, which is measured by a microwave orientation meter, is in a range of 1 to 1.1.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

A resin film includes a resin composition for forming a flexible resin layer. The resin composition includes an elastomer, a polymerizable compound, and a polymerization initiator. A laminated film includes a base material film, a resin film formed on the base material film, and a protective film attached to the resin film.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), ##STR00001## (B-2) a repeating unit of formula (II), ##STR00002##
and (B-3) a repeating unit of formula (III), ##STR00003## R.sup.1 to R.sup.22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

A flame retardant is included in a resin phase, and the flame retardant has a maximum number frequency in a range of 1 μm or less when a particle size distribution is evaluated by dividing a particle size into 1 μm increments. The resin phase includes inorganic particles, and the inorganic particles have a maximum number frequency in a range of 0.5 μm or less when the particle size distribution is evaluated by dividing the particle size into 0.5 μm increments. The flame retardant has an average particle size larger than the average particle size of inorganic particles. The number frequency of the flame retardant and the inorganic particles, respectively, decreases with increasing the particle size.

A semi-finished product of an electric heater device has a casing body (2) defining a housing for at least one electric heater. The casing body (2) has a first or predefined configuration, in particular a substantially planar, or plate-like, or two-dimensional configuration, and is prearranged for being folded in substantially predetermined areas (1a), which define in the casing body (2) a plurality of regions (4, 5, 6) that are at least in part relatively stiff and are suitable to be folded with respect to one another in one said folding area (1a). In this way, a second or different configuration, in particular a substantially three-dimensional configuration, can be bestowed upon the casing body (2).

A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.