A display apparatus includes a substrate including a display area, a non-display area outside the display area, a pad area located in the non-display area, and a bending area between the display area and the pad area. The display apparatus includes a first voltage line having a first main voltage line disposed between the display area and the bending area, and a first connection portion protruding from the first main voltage line, extending toward the pad area, and crossing the bending area. The display apparatus includes a fan-out portion disposed between the display area and the pad area on the substrate and including conductive lines that connect the display area to the pad area, and a strain gauge disposed in the bending area. The strain gauge overlaps the first connection portion of the first voltage line in the bending area.

A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 -cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and The second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support.

A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.

An item may include fabric or other materials formed from intertwined strands of material. The item may include circuitry that produces signals. The strands of material may include non-conductive strands and conductive strands. The conductive strands may carry the signals produced by the circuitry. Each conductive strand may have a strand core, a conductive coating on the strand core, and an insulating layer on the conductive coating. The strand cores may be strands formed from polymer. The conductive coating may be formed from metal. Electrical connections may be made between intertwined conductive strands by selectively removing portions of the outer insulating layer to expose the conductive cores of overlapping conductive strands. A conductive material such as solder or conductive epoxy may be applied to the exposed portions of the conductive cores to electrically and mechanically connect the overlapping conductive strands.

Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

A flexible substrate and a method thereof are provided. The flexible substrate includes a first flexible layer fabricated with at least one conducting path, and configured to sustain an electric power within the conducting path, a second flexible layer fabricated with one or more sensors connected in a form of a matrix, and the second flexible layer configured to generate a signal upon receiving an interaction from at least one user, a third flexible layer fabricated in-between the first flexible layer and the second flexible layer, and configured to insulate the conducting path of the first flexible layer from a matrix connection of the second flexible layer, at least one support structure operatively coupled to the first flexible layer, the second flexible layer and the third flexible layer, and configured to receive the signal generated by the second flexible layer and to provide a support.

A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

A composite includes a plastic substrate and an electrical insulator layer formed on the plastic substrate. The electrical insulator layer contains boron nitride nanotubes (BNNTs), which may be unmodified or modified BNNTS. The composite is suitable for use in making printed electronic devices. A process includes providing a plastic substrate and forming on at least a portion of a surface of the plastic substrate a layer that contains the BNNTs. A metallic ink trace is formed on a portion of the layer, such that the metallic ink trace is spaced-apart from the substrate. Using photonic or thermal sintering techniques, the metallic ink trace is then sintered.