A ceramic substrate includes a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag). In an adjacent region located adjacent to the conductor trace, the concentration of boron atoms (B) contained in the ceramic layer increases toward the conductor trace.

An electronic component that includes: an element body; and an insulating film covering an outer surface of the element body. The insulating film has a mix layer and a glass layer. The mix layer has a first glass and powder particles. The glass layer contains a second glass and has a smaller content percentage of the powder particles than the mix layer. The mix layer is on a side of the insulating film closer to the element body when viewed from the glass layer.

A hair iron according to one example embodiment includes a first arm and a second arm movable relative to each other between an open position and a closed position. A contact surface is positioned on an exterior of the first arm for contacting hair during use. The hair iron includes a heater having a ceramic substrate and an electrical resistor material thick film printed on a surface of the ceramic substrate. The heater generates heat by applying an electric current to the electrical resistor material. The heater is positioned to supply heat to the contact surface.

A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.

A hair iron according to one example embodiment includes a first arm and a second arm movable relative to each other between an open position and a closed position. A contact surface is positioned on an exterior of the first arm for contacting hair during use. The hair iron includes a heater having a ceramic substrate and an electrical resistor material thick film printed on a surface of the ceramic substrate. The heater generates heat by applying an electric current to the electrical resistor material. The heater is positioned to supply heat to the contact surface.

Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 1010.sup.6/ C. to 1610.sup.6/ C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.

A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

A method of manufacturing a constituent for a component carrier is disclosed. The method includes providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, and subsequently, attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.