A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

The invention provides an IG unit comprising two panes and a between-pane space located between the two panes. A desired surface of a selected one of the two panes bears a coating comprising both a transparent conductive oxide film, and an overcoat film located over the transparent conductive oxide film. The IG unit further comprises a bus bar and a transparent conductor bridge each located over the desired surface. The bus bar is spaced apart from the coating and is connected electrically to the transparent conductive oxide film by virtue of the transparent conductor bridge extending from the bus bar to a top surface of the overcoat film. In some embodiments, the IG unit further comprises a frit located over the desired surface and extending around a perimeter thereof. The bus bar is located over the frit. Certain embodiments provide a refrigerator having a door comprising such an IG unit.

A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region.

A modulated inductance module includes an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element formed on a semiconductor die, wherein the inductor further has two or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout said ceramic element, the ceramic element has crystalline grain structure having a diameter that is less than or equal to 1.5× a mean grain diameter, and the semiconductor die contains active semiconductor switches or rectifying components that are in electrical communication with the one or more electrical conductors of the inductor.

A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region having a thickness of 5 μm adjoins and surrounds the via-conductor and has a higher concentration of the metal element than the ceramic insulator.

A multilayer substrate includes insulating base materials stacked in a stacking direction, at least one conductor pattern on at least one of the insulating base materials, the at least one conductor pattern including two opposite major surfaces, and insulating protective films on both of the two opposite major surfaces of the at least one conductor pattern.

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.