The invention provides an IG unit comprising two panes and a between-pane space located between the two panes. A desired surface of a selected one of the two panes bears a coating comprising both a transparent conductive oxide film, and an overcoat film located over the transparent conductive oxide film. The IG unit further comprises a bus bar and a transparent conductor bridge each located over the desired surface. The bus bar is spaced apart from the coating and is connected electrically to the transparent conductive oxide film by virtue of the transparent conductor bridge extending from the bus bar to a top surface of the overcoat film. In some embodiments, the IG unit further comprises a frit located over the desired surface and extending around a perimeter thereof. The bus bar is located over the frit. Certain embodiments provide a refrigerator having a door comprising such an IG unit.

A substrate is disclosed. In an embodiment, a substrate includes a ceramic main body, an organic surface structure on at least one first outer face of the ceramic main body and outer redistribution layers integrated into the organic surface structure.

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

A modulated inductance module includes an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element formed on a semiconductor die, wherein the inductor further has two or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout said ceramic element, the ceramic element has crystalline grain structure having a diameter that is less than or equal to 1.5 a mean grain diameter, and the semiconductor die contains active semiconductor switches or rectifying components that are in electrical communication with the one or more electrical conductors of the inductor.

A printed circuit board includes an insulating material and a circuit, formed on a surface of the insulating material. The circuit comprises a seed layer formed on the surface of the insulating material, an anti-reflection layer formed on the seed layer, and an electroplating layer formed on the anti-reflection layer.

A substrate is disclosed. In an embodiment, a substrate includes a ceramic main body, an organic surface structure on at least one first outer face of the ceramic main body and outer redistribution layers integrated into the organic surface structure.

A wiring board includes: an insulating layer that includes a first surface over which an electronic component is mounted and a second surface opposite to the first surface; a conductive layer that is disposed on the second surface; a via that is provided inside a first through-hole that penetrates a portion between the first surface and the second surface of the insulating layer; an electrode that is disposed on the first surface and connected to the via; and a glass plate that is not contact with the conductive layer and is disposed on the first surface and includes a second through-hole through which the electrode is disposed.

An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.

A printed wiring board includes: a first insulating layer having a first surface and a second surface opposite from the first surface; a second insulating layer stacked on the first surface of the first insulating layer; and a conductor wiring interposed between the first insulating layer and the second insulating layer. The first insulating layer contains a liquid crystal polymer. The second insulating layer contains a cured product of a thermosetting composition, containing an inorganic filler and a thermosetting component, and a fibrous base member. A temperature, at which a decrease in the mass of the second insulating layer that has had its temperature increased at a temperature increase rate of 10 C./min from an initial-state temperature of 25 C. reaches 5% of its initial-state mass, is equal to or higher than 355 C.