In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.

A printed wiring board includes a core substrate including core material and having opening through the core material, first electronic components in the opening each including a first electrode, second electronic components in the opening each including a third electrode, a first build-up layer formed on surface of the substrate and including a first insulating layer, a first conductor layer on the first insulating layer, first via conductors through the first insulating layer and connecting to the first conductor layer, and a third resin insulating layer on the first insulating layer. The first conductor layer includes first conductor circuit formed directly over the opening, and on-core-material first conductor circuit directly over the core material. Groups of the first via conductors connect the first electrodes to the first conductor circuit and the third electrodes to the first conductor circuit. Each first via conductor in the groups has a recessed top portion.

An obfuscated radio frequency circuit may be manufactured to include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having different dielectric constants to obfuscate functions of the circuit.

A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material,
wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

An electronic circuit including a substrate having a first dielectric characteristic. The substrate can include a first side and a second side. An intermediary material can be disposed within the substrate. For instance, the intermediary material can be located between the first side and the second side. The intermediary material can include a second dielectric characteristic, where the second dielectric characteristic is different than the first dielectric characteristic. A first conductive layer can be disposed on the first side, and a second conductive layer can be disposed on the second side. A conductive path can be electrically coupled between the first conductive layer and the second conductive layer. The conductive path can be in contact with at least a portion of the intermediary material.

A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.

Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.