A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

Surgical devices include adapter assemblies which electrically and mechanically interconnect handles of electromechanical surgical devices to surgical loading units. Electrical components of the surgical devices are coated with a multi-layer conformal coating which permits the devices to be sterilized in an autoclave without damaging the electrical components.

A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.

Package to printed circuit board (PCB) transitions are described. In one aspect, a multi-layer PCB includes an external layer having a transition region configured to receive an electrical component and a clear routing region outside of the transition region. The PCB includes first via(s) that extend from the transition region to an inner trace routing layer. The trace routing layer is disposed between the external layer and the second inner trace routing layer. The first inner trace routing layer includes a transition area disposed under the transition region of the external layer, a clear routing area outside of the transition region, and a transmission line that connects a given first via to a second via for a second electrical component. The transmission line includes conductive trace(s) that each have a first width in the transition area and a second width, greater than the first width, in the clear routing area.

A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer.

A multi-phase busbar for conducting electric energy includes: a base layer of an insulating material; a first conducting layer of a sheet metal; a first insulating layer of an insulating material arranged on the first conducting layer; a second conducting layer of a sheet metal arranged on the insulating layer; and a second layer of an electrically insulating material which is arranged on the second conducting layer. The first and/or second insulating layers include spacers, each spacer including a layer of a rigid insulating material. At least one of the spacers is glued to an electrically insulating coating of the first and/or second conducting layer, and/or at least one of the spacers is glued to an electrically conductive surface of an uncoated first and/or second conducting layer by an adhesive.

A metal-clad laminate, a printed circuit board using the same and a method for manufacturing the metal-clad laminate. The metal-clad laminate comprises: a first dielectric layer, comprising a first dielectric material and not comprising a reinforcing fabric, the first dielectric material comprising 20 wt % to 60 wt % of a first fluoropolymer and 40 wt % to 80 wt % of a first filler; a second dielectric layer disposed on one side of the first dielectric layer and comprising a reinforcing fabric and a second dielectric material formed on the surface of the reinforcing fabric, wherein the thickness of the reinforcing fabric is not higher than 65 μm and the second dielectric material comprises 55 wt % to 100 wt % of a second fluoropolymer and 0 to 45 wt % of a second filler; and a metal foil disposed on the other side of the second dielectric layer that is opposite to the first dielectric layer.

A circuit board according to an embodiment includes a first substrate layer; a second substrate layer disposed on the first substrate layer; and a third substrate layer disposed under the first substrate layer; wherein the second substrate layer includes: a first inner circuit pattern layer disposed on the first substrate layer; and a first outermost circuit pattern layer disposed on the first inner circuit pattern layer; wherein the third substrate layer includes: a second inner circuit pattern layer disposed under the first substrate layer; and a second outermost circuit pattern layer disposed under the second inner circuit pattern layer; wherein a thickness of the first outermost circuit pattern layer is greater than a thickness of each of the first inner circuit pattern layer and the second inner circuit pattern layer.