The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.

This document describes an interactive object with multiple electronics modules. An interactive object (e.g., a garment) includes a plurality of conductive threads woven into the interactive object, and an internal electronics module coupled to the array of conductive thread. The internal electronics module includes a first subset of electronic components, such as sensing circuitry configured to detect touch-input to the grid of conductive thread. An external electronics module that includes a second subset of electronic components (e.g., a microprocessor, power source, or network interface) is removably coupled to the interactive object via a communication interface. The communication interface enables communication between the internal electronics module and the external electronics module when the external electronics module is coupled to the interactive object.

Provided is a wearable device and a method of manufacturing the same. The wearable device includes: a wearable flexible printed circuit board having a circuit pattern formed on a base substrate having flexibility, air-permeability, and waterproofness; and a functional module mounted on the wearable flexible printed circuit board.

One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150 C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.

Provided is a wearable flexible printed circuit board, in which a conductive circuit pattern is formed on a fiber web formed by accumulating fibers, and thus a base substrate has flexibility, resilience, waterproofness and air-permeability so as to be applied to future-oriented devices, a manufacturing method thereof, and a wearable smart device using the same. The wearable flexible printed circuit board includes: a base substrate made of a fiber web that is formed by accumulating spun fibers made of a fiber-forming polymer material and having a diameter of 3 m or less; and a conductive circuit pattern formed on the base substrate.

A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.

A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 m, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.

Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

A material sheet for circuit board fabrication is provided. The material sheet includes liquid crystal polymer (LCP) fibers impregnated in a dielectric having a dissipation factor between 0.004 and 0.0002.