Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

This disclosure provides electrically conductive materials, including electrically conductive textile materials, such as woven or knitted fabric textiles, individual fibers, and woven fibers and yarns. The conductive materials comprise a substrate material, such as a textile or other suitable material, and a metal embedded in the substrate material, in particular where the metal is embedded into and below the surface of the material. Also provided are methods of making the electrically conductive materials.

A yarn adaptable to incorporation into a textile comprises a core including one or more electrically conductive traces arranged on the core and distributed over at least a portion of the length of the yarn. The yarn also comprises an electrically contactable terminal arranged at a terminus of the one or more conductive traces and a winding wrapped around the core.

This disclosure provides a stretchable conductor structure, a garment with a stretchable conductor structure, and a method for producing a stretchable conductor structure. The conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate can return the mesh structure of the set of conductive wires to an original state after the manipulation.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A machine knittable hybrid yarn for providing conductive traces through a textile is disclosed. The hybrid yarn includes conductive wires coated with an insulating material and twisted together with a nonconductive yarn. The nonconductive yarn is from a strong, inelastic, and nonconductive fiber, such as a meta-aramid or para-aramid that protects the integrity of the conductive wire during knitting. The conductive wire can be copper-clad stainless steel or copper wire is coated with polyurethane, and the nonconductive yarn can have no-drip and no-drip properties to allow ablation of the hybrid yarn to remove the conductive yarn and insulating coating on the wire such that the ablated region becomes externally conductive and suitable for making an electrical contact. The hybrid yarn can be bonded with nylon or similar polymer after twisting.

A wearable monitoring device comprising a printed circuit board having a first side and a second side opposite the first side, wherein the printed circuit board is configured to couple to at least one sensor configured to monitor a physiological condition; at least a first padding layer coupled to the printed circuit board proximate the first side; at least a second padding layer coupled to the printed circuit board proximate the second side; a first protective layer coupled to the first padding layer opposite the printed circuit board; a second protective layer coupled to the second padding layer opposite the printed circuit board; at least one additional layer between the first protective layer opposite the printed circuit board; the first protective layer and the second protective layer seal together and enclose the first and second padding and the printed circuit board; and a power source coupled to the printed circuit board.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A flexible circuit board and a display panel are provided. The flexible circuit board includes a base body and a protective layer disposed on the base body. The protective layer includes a glue layer, a first cover layer, a patterned function layer, and a second cover layer sequentially stacked on the base body. The patterned function layer includes a frame and a plurality of bendable components disposed in the frame. The bendable components are arranged in the frame at intervals, and an arrangement direction of the bendable components is consistent with a bent direction of the flexible circuit board.