Disclosed are a fiber composite laminate including a self-assembled conductive paste and a method of manufacturing the same. The fiber composite laminate includes a fiber-based circuit unit including a fiber substrate and a circuit electrode positioned on the fiber substrate, a composite binder unit positioned on the fiber-based circuit unit, and a connection unit including a connection electrode positioned on the composite binder unit and a flexible substrate positioned on the composite binder unit and the connection electrode. The fiber composite laminate can thus be applied to wearable devices having increased conductivity and durability of joints thereof, a minimized foreign-body sensation, and an improved wearing sensation. Moreover, productivity can be increased owing to a simple manufacturing process, and mass production becomes possible.

A fiber composite component with integrated active electromagnetic shielding includes a fiber composite layer having reinforcing fibers, and an electric conductor, which extends on the fiber composite layer along the fiber composite layer and produces an electromagnetic field during operation, wherein a proportion of the reinforcing fibers is designed as conduction fibers, which are arranged to follow the electric conductor within the fiber composite layer and are designed to produce an opposing electromagnetic field during operation which attenuates the electromagnetic field of the electric conductor.

A flexible circuit board and a display panel are provided. The flexible circuit board includes a base body and a protective layer disposed on the base body. The protective layer includes a glue layer, a first cover layer, a patterned function layer, and a second cover layer sequentially stacked on the base body. The patterned function layer includes a frame and a plurality of bendable components disposed in the frame. The bendable components are arranged in the frame at intervals, and an arrangement direction of the bendable components is consistent with a bent direction of the flexible circuit board.

Conductive yarns in a knitted fabric may include insulating cores covered with metal layers that form signal paths. Open circuits may be formed in the yarns by removing metal from the insulating cores at selected locations within the yarns. The fabric may be formed from rows of interlocked loops of the yarn. The open circuits may be located on the loops so that each loop with an open circuit has a first segment of the metal layer that is separated from a second segment of the layer by a portion of the loop from which the metal layer has been removed. Each electrical component may have terminals that span a respective one of the open circuits and that are shorted respectively to the metal of the first and second segments.

Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130 C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.

Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

A wearable monitoring device comprising a printed circuit board having a first side and a second side opposite the first side, wherein the printed circuit board is configured to couple to at least one sensor configured to monitor a physiological condition; at least a first padding layer coupled to the printed circuit board proximate the first side; at least a second padding layer coupled to the printed circuit board proximate the second side; a first protective layer coupled to the first padding layer opposite the printed circuit board; a second protective layer coupled to the second padding layer opposite the printed circuit board; at least one additional layer between the first protective layer opposite the printed circuit board; the first protective layer and the second protective layer seal together and enclose the first and second padding and the printed circuit board; and a power source coupled to the printed circuit board.

This disclosure provides a stretchable conductor structure, a garment with a stretchable conductor structure, and a method for producing a stretchable conductor structure. The conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate can return the mesh structure of the set of conductive wires to an original state after the manipulation.

A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.