Patent classifications
H05K2201/0287
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
A circuit board includes at least one prepreg including a fiber layer, the fiber layer being woven with a plurality of first fibers arranged in a first direction and a plurality of second fibers arranged in a second direction that is substantially perpendicular to the first direction, and a circuit layer on at least one of opposite surfaces of the at least one prepreg. The at least one prepreg has a length in the first direction greater than a length in the second direction, each of the plurality of first fibers is formed of or includes a filling yarn, and each of the plurality of second fibers is formed of or includes a warp yarn.
Stretchable printed battery and methods of making
A stretchable battery and the method of manufacturing the same. The stretchable battery can be manufactured by using a printing process. The construction of the stretchable battery can comprise a first layer of an elastomer film, a first current collector layer, a layer of cathode, a separating layer, a layer of anode, and a second current collector layer. Metal traces can be used to couple with the first and/or the second current collector layers.
Methods of sewing components in fabrics using metal wire cloth
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.
Package board and prepreg
A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.
Methods of interconnecting components on fabrics using metal braids
An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.
Methods of attaching components on fabrics using metal braids
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.
Methods of stitching components on fabrics using metal foils
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.
Flexible circuit board and method of fabricating
A flexible circuit board includes a center rigid section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.
Foldable display
A foldable display is disclosed. In one aspect, the foldable display includes a base substrate including a flexible area and a rigid area disposed at one or more sides of the flexible area. The foldable display also includes an image display device provided on the base substrate. The base substrate includes a matrix and a textile implanted in the matrix. The textile includes a flexible part corresponding to the flexible area and a rigid part corresponding to the rigid area. The rigid part is weaved differently from the flexible part.
PACKAGE BOARD AND PREPREG
A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.