H05K2201/029

METHOD AND APPARATUS FOR ATTACHING CHIP TO A TEXTILE
20210087721 · 2021-03-25 ·

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

PREPREG, COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD
20210054158 · 2021-02-25 ·

A prepreg is a blend of a fiber reinforcement, a matrix resin and a filler. Based on 100 parts by mass of the prepreg, the fiber reinforcement is 20-60 parts by mass, the matrix resin is 20-65 parts by mass, and the filler is 10-40 parts by mass. The filler is a flame-retardant organic microsphere or a blend of the flame-retardant organic microsphere and an inorganic filler, and the particle size of the filler is preferably 0.1 microns to 15 microns. A copper-clad laminate and a printed circuit board are also disclosed. In various embodiments, the stability of material properties of the prepreg can be improved, the prepreg manufacturing process is simplified, the prepreg production efficiency is improved. Due to the high production efficiency of the prepreg, the manufacturing cost of the prepreg, the copper-clad laminate and the printed circuit board can be reduced.

Glass cloth, prepreg, and glass fiber reinforced resin molded product

Provided is a glass cloth enabling to reduce a mass of the glass cloth, being manufactured efficiently, suppressing generation of pinholes in a prepreg including the glass cloth, and maintaining excellent appearance. The glass cloth is composed of warps and wefts obtained by bundling 30 to 44 glass filaments having a diameter in the range of 3.0 to 4.0 m, the weave densities of the warp and the weft being in the range of 100 to 125 yarns/25 mm; the glass cloth has a thickness in the range of 6.5 to 11.0 m; the glass yarn coverage C is 85.5 to 99.5%; and the glass yarn coverage C, the average value F of the number of glass filaments constituting the warp and the weft, and the average value D of the weave densities of the warp and the weft satisfy the following expression (1):
53.0CF.sup.1/2/D.sup.1/257.3(1).

Method for estimating the simulated contour of a material composed of longitudinal and transverse line elements
10962356 · 2021-03-30 ·

A method of estimating a virtual contour of an insulating material is disclosed. The method includes the following steps: obtaining a first and a second images at a pair of diagonal locations of the insulating material respectively; determining a first and a second corner locations from the first and the second images respectively; selecting a first set of longitudinal end-point positions and a first set of transverse end-point positions within a range between a first specific distance and a second specific distance from the first corner location; selecting a second set of longitudinal end-point positions and a second set of transverse end-point positions within a range between the first specific distance and the second specific distance from the second corner location; and determining a first transverse axis direction, a first longitudinal axis direction, a second transverse axis direction and a second longitudinal axis direction based on these positions.

Stretchable Signal Path Structures for Electronic Devices

A stretchable fabric signal path may include a conductive strand located between first and second outer fabric layers. The outer fabric layers may be formed from intertwined strands of elastic material. The conductive strand may have a wavy shape to accommodate stretching of the stretchable fabric signal path. First and second inner fabric layers may be located between the outer stretchable fabric layers. The inner fabric layers may be formed from intertwined strands of non-elastic material. The inner fabric layers may have strands that are intertwined with the outer fabric layers to serve as anchor points for maintaining the shape of the conductive strand as the stretchable fabric signal path expands and contracts. The outer fabric layers and inner fabric layers may be woven. The conductive strand may convey electrical signals such as audio signals, power signals, data signals, or other suitable signals.

FLUOROPLASTIC SUBSTRATE FOR HIGH-SPEED COMMUNICATIONS AND COPPER-CLAD FLUOROPLASTIC SUBSTRATE FOR HIGH-SPEED COMMUNICATIONS

A fluoroplastic substrate for high-speed communications has a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a permittivity at 40 GHz of from 2.0 to 3.2. The substrate includes a quartz glass cloth having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a fluoroplastic having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0005.

Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4.

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Wiring board, laminated wiring board, and semiconductor device

A wiring board includes a first interconnect layer, a first insulating layer covering the first interconnect layer, a second interconnect layer, thinner than the first interconnect layer, formed on the first insulating layer and having an interconnect density higher than that of the first interconnect layer, and a second insulating layer formed on the first insulating layer and covering the second interconnect layer. The first insulating layer includes a first layer including no reinforcing material, and a second layer including a reinforcing material. The first and second layers include a non-photosensitive thermosetting resin as a main component thereof. The first layer has a coefficient of thermal expansion higher than that of the second layer, and the second insulating layer includes a photosensitive resin as a main component thereof. The second interconnect layer includes an interconnect formed directly on and electrically connected to the first interconnect layer.

Light emitting display system having improved fire performance

Disclosed are embodiments of fire resistant display components, systems and associated methods. The system comprises a plurality of light emitting display modules, each display module being constructed to have improved fire resistance as measured by one or more fire performance characteristics including heat release, smoke density, smoke toxicity, flame spread or drip.

METAL-CLAD LAMINATE AND MANUFACTURING METHOD OF THE SAME
20200404782 · 2020-12-24 ·

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.