A flexible fiber substrate and a flexible display device including the same are provided. The flexible fiber substrate includes: an insulating body woven from an insulating fiber and a patterned conductive member made of a conductive fiber. The conductive member and the insulating body are fixed to each other by interlacing, and the conductive member is touchable from outside of the flexible fiber substrate.

In an embodiment, a dielectric composite comprises a thermoset derived from a functionalized poly(arylene ether). a triallyl (iso)cyanurate, and a functionalized block copolymer; a hydrophobized fused silica; and a reinforcing fabric. The dielectric composite can be prepared by forming a thermosetting composition comprising the methacrylate functionalized poly(arylene ether), the triallyl (iso)cyanurate, the functionalized block copolymer, the hydrophobized fused silica, an initiator, and a solvent; coating the reinforcing fabric with the thermosetting composition; at least partially curing the thermosetting composition to form a prepreg; and optionally laminating the prepreg and at least one electrically conductive layer to form the circuit material.

The present invention provides the substrate comprises a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, wherein the surface-treated fiber film has a value of a conventional flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a conventional flexural rigidity of an untreated fiber film. There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.

A sensing element has a signaling yarn and a single core wire that is intersecting with the signaling yarn. A sensing control system includes the sensing element, a sensing control module, and a central control module. The sensing control module is configured to output a scanning signal to the sensing element, receive a sensing signal corresponding to the sensing component, and generate a sensing result according to the sensing signal. The central control module is electrically connected to the sensing control module, and is configured to control a component according to the sensing result. Thereby, the sensing element of the application can be manufactured by a simple process and has a relatively small volume, and achieve the sensing operation in conjunction with the sensing control system.

One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

A circuit board includes at least one prepreg including a fiber layer, the fiber layer being woven with a plurality of first fibers arranged in a first direction and a plurality of second fibers arranged in a second direction that is substantially perpendicular to the first direction, and a circuit layer on at least one of opposite surfaces of the at least one prepreg. The at least one prepreg has a length in the first direction greater than a length in the second direction, each of the plurality of first fibers is formed of or includes a filling yarn, and each of the plurality of second fibers is formed of or includes a warp yarn.

Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

To overcome the problem of the fiber weave effect desynchronizing differential signals in a pair of traces of approximately the same length in a printed circuit board, the pair of traces can be routed to traverse largely parallel paths that are above one another in the printed circuit board. The material between the paths can include weaved fiber bundles. The material on opposite sides of the paths, surrounding the pair of traces and the weaved fiber bundles, can include resin-rich material. As a result, the pair of traces are directly adjacent to the same materials, which can allow signals in the traces to propagate at the same speed, and prevent desynchronization of differential signals traversing the paths. The path length difference associated with traversing to different depths can be compensated with a relatively small in-plane diagonal jog of one of the traces.

The present application describes the creation of a flexible textile structure with sensing and lighting capabilities without the loss of important features of a typical textile, for instance, comfort, seamless and mechanical flexibility. As sensing applications are described three different approaches that may or may not work together in the same system: a directly printed self-capacitive sensor, a knitted textile sensor and the integration of temperature/humidity bulk capacitive sensors directly on the textile. As lighting applications for decorative and signage purposes are used two different approaches that could work individually or together: an electroluminescent sensing device and the use of a hybrid sensor that includes the use of SMD LEDs and a printed self-capacitive sensor. The sensing and lighting applications previously described can be used, as an example, inside an automobile passenger compartment since they are easily integrated on seats with different geometries, armrests and central panels to substitute common mechanical buttons and sensing devices, and create a cleaner and seamless environment, following current tendencies in car interiors.