A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 m to 630 m, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer. The thick conductor built-in type printed wiring board does not include a void having a diameter of more than or equal to 10 m inside the thick conductor built-in type printed wiring board.

A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.

A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.

A wiring board includes a first interconnect layer, a first insulating layer covering the first interconnect layer, a second interconnect layer, thinner than the first interconnect layer, formed on the first insulating layer and having an interconnect density higher than that of the first interconnect layer, and a second insulating layer formed on the first insulating layer and covering the second interconnect layer. The first insulating layer includes a first layer including no reinforcing material, and a second layer including a reinforcing material. The first and second layers include a non-photosensitive thermosetting resin as a main component thereof. The first layer has a coefficient of thermal expansion higher than that of the second layer, and the second insulating layer includes a photosensitive resin as a main component thereof. The second interconnect layer includes an interconnect formed directly on and electrically connected to the first interconnect layer.

A flexible fiber substrate and a flexible display device including the same are provided. The flexible fiber substrate includes: an insulating body woven from an insulating fiber and a patterned conductive member made of a conductive fiber. The conductive member and the insulating body are fixed to each other by interlacing, and the conductive member is touchable from outside of the flexible fiber substrate.

Provided is a glass cloth enabling to reduce a mass of the glass cloth, being manufactured efficiently, suppressing generation of pinholes in a prepreg including the glass cloth, and maintaining excellent appearance. The glass cloth is composed of warps and wefts obtained by bundling 30 to 44 glass filaments having a diameter in the range of 3.0 to 4.0 m, the weave densities of the warp and the weft being in the range of 100 to 125 yarns/25 mm; the glass cloth has a thickness in the range of 6.5 to 11.0 m; the glass yarn coverage C is 85.5 to 99.5%; and the glass yarn coverage C, the average value F of the number of glass filaments constituting the warp and the weft, and the average value D of the weave densities of the warp and the weft satisfy the following expression (1):

53.0CF.sup.1/2/D.sup.1/257.3 (1).

A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

The present invention provides a stress relaxation substrate for relaxing stress generated due to differences in the hardness of a circuit substrate and a cloth body. This stress relaxation substrate is disposed between a cloth body and a circuit board having a wiring, wherein the stress relaxation substrate includes a stress relaxation layer harder than the cloth body, and softer than the circuit board, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive portion provided on the stress relaxation layer to be formed between a first surface and a second surface.

A printed circuit board includes a spread weave of fibers having a first direction and a second direction with corresponding fibers spread more in the first direction than the second direction; and one or more pairs of traces on the spread weave of fibers, wherein the first direction has less differences in dielectric permittivity seen by each trace than the second direction, wherein the one or more pairs of traces are routed according to a routing design that includes one or more fixed regions on the spread weave of fibers, where routing of traces therein is restricted to linear, non-angled routed in the first direction.