Apparatuses, systems and methods associated with substrate assemblies for computer devices are disclosed herein. In embodiments, a core for a substrate assembly includes a first metal region, a second metal region, and a dielectric region located between the first metal region and the second metal region. The dielectric region includes one or more fibers, wherein each of the one or more fibers includes aluminum, boron, silicon, or oxide. Other embodiments may be described and/or claimed.

One manner of producing more desirable clothing with electronic capabilities is to manufacture electronics, such as the charging wires or devices themselves, directly onto the textile materials. Textile materials generally do not support the manufacturing of electronic devices, in part because the surface of the textile is too rough for electronic devices or the processes used to manufacture electronic devices. An intermediate layer may be placed on the textile material to reduce the roughness of the surface of the textile material and provide other beneficial characteristics for the placement of electronic devices directly on the textile material.

The present invention relates to a laminate including two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition, the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y), the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers, the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and the second glass fibers having a higher tensile elastic modulus at 25? C. than the first glass fibers, a printed wiring board including the laminate, a semiconductor package, and a method for producing a laminate.

An electronic-grade glass fiber composition includes the following components with corresponding amounts by weight percentages 51.0-57.5% SiO.sub.2, 11.0-17.0% Al.sub.2O.sub.3, >4.5% and 6.4% B.sub.2O.sub.3, 19.5-24.8% CaO, 0.1-1.9% MgO, 0.05-1.2% R.sub.2O=Na.sub.2O+K.sub.2O+Li.sub.2O, 0.05-0.8% Fe.sub.2O.sub.3, 0.01-1.0% TiO.sub.2, and 0.01-1.0% F.sub.2. A weight percentage ratio C1=SiO.sub.2/B.sub.2O.sub.3 is 8.1-12.7, a weight percentage ratio C2=B.sub.2O.sub.3/(R.sub.2O+MgO) is 1.7-6.3, and a total weight percentage of the above components is greater than or equal to 99%.

An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.

A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 m or more and 300 m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200 C. as measured by a TMA method according to JIS K7197 are each within a range of 30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation 1(%) of a film surface S1 exposed and a degree of orientation 2(%) of a film surface S2 located at a depth of 5 m from the film surface S1 satisfy a relationship of 4.0[(21)/1]1000.0; (B) a hardness H1 at a point of a depth of 1 m located at a position of 1 m from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy 10.0100(H2H1)/H10.0.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

A wiring board includes: a support body including at least one woven fabric woven from weaving yarns that are each formed by bundling insulating fibers; and a conductive body supported by the support body. The conductive body includes a first conductive path disposed on a first main face of the support body and that extends in a planar direction of the first main face. The first conductive path includes at least one of a first conductor portion disposed in a basket hole of the woven fabric and a first intervening portion disposed in a gap between the insulating fibers.